ELECTRICAL AND COMPUTER ENGINEERING

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	Issue Date	Title	Author(s)
941	Feb-2005	Thermally robust TaTbxN metal gate electrode for n-MOSFETs applications	Ren, C.; Yu, H.Y. ; Wang, X.P.; Ma, H.H.H. ; Chan, D.S.H. ; Li, M.-F. ; Yeo, Y.-C. ; Tung, C.H.; Balasubramanian, N.; Huan, A.C.H.; Pan, J.S.; Kwong, D.-L.
942	2009	Thermally robust phosphorous nitride interface passivation for InGaAs self-aligned gate-first n-MOSFET integrated with high-k dielectric	Oh, H.J. ; Lin, J.Q.; Suleiman, S.A.B.; Lo, G.Q.; Kwong, D.L.; Chi, D.Z.; Lee, S.J.
943	2003	Thermally Robust High Quality HfN/HfO 2 Gate Stack for Advanced CMOS Devices	Yu, H.Y. ; Kang, J.F. ; Chen, J.D. ; Ren, C.; Hou, Y.T. ; Whang, S.J. ; Li, M.-F. ; Chan, D.S.H. ; Bera, K.L.; Tung, C.H.; Du, A.; Kwong, D.-L.
944	Apr-2004	Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications	Yu, H.Y. ; Li, M.-F. ; Kwong, D.-L.
5	19-Sep-2011	Thermally induced currents in graphene-based heterostructure	Zeng, M. ; Feng, Y. ; Liang, G.
6	12-Mar-2014	Thermally assisted domain wall nucleation in perpendicular anisotropy trilayer nanowires	Narayanapillai, K.; Qiu, X.; Rhensius, J.; Yang, H.
7	2013	Thermal-aware mapping of streaming applications on 3D Multi-Processor Systems	Cox, M.; Singh, A.K.; Kumar, A. ; Corporaal, H.
8	2014	Thermal-aware frequency scaling for adaptive workloads on heterogeneous MPSoCs	Yu, H.; Syed, R.; Ha, Y.
9	2008	Thermal-aware electrical analysis of high-speed interconnect	Liu, E.-X.; Li, E.-P. ; Wei, X.
10	12-Jan-2011	Thermal transport in suspended and supported few-layer graphene	Wang, Z.; Xie, R. ; Bui, C.T.; Liu, D.; Ni, X.; Li, B. ; Thong, J.T.L.
11	May-2008	Thermal transient response of GaAs FETs under intentional electromagnetic interference (IEMI)	Xu, J.; Yin, W.-Y.; Mao, J.-F.; Li, L.-W.J.
12	1999	Thermal studies on stress-induced void-like defects in epitaxial-CoSi 2 formation	Ho, C.S.; Pey, K.L. ; Tung, C.H.; Tee, K.C.; Prasad, K.; Saigal, D.; Tan, J.J.L.; Wong, H.; Lee, K.H.; Osipowicz, T. ; Chua, S.J. ; Karunasiri, R.P.G.
13	2006	Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2gate dielectric	Yeo, C.C. ; Cho, B.J. ; Lee, M.H.; Liu, C.W.; Choi, K.J.; Lee, T.W.
14	1-Mar-2004	Thermal stability of nitrogen incorporated in HfN xO y gate dielectrics prepared by reactive sputtering	Kang, J.F. ; Yu, H.Y. ; Ren, C.; Li, M.-F. ; Chan, D.S.H. ; Hu, H.; Lim, H.F. ; Wang, W.D.; Gui, D.; Kwong, D.-L.
15	Jun-2000	Thermal stability of MISFET with low-temp molecular-beam epitaxy-grown GaAs and Al0.3Ga0.7As gate Ins	Rao, R.V.V.V.J. ; Chong, T.C. ; Tan, L.S. ; Lau, W.S.
16	4-Nov-2002	Thermal stability of (HfO2)x(Al2O 3)1-x on Si	Yu, H.Y. ; Wu, N.; Li, M.F. ; Zhu, C. ; Cho, B.J. ; Kwong, D.-L.; Tung, C.H.; Pan, J.S.; Chai, J.W.; Wang, W.D.; Chi, D.Z.; Ang, C.H.; Zheng, J.Z.; Ramanathan, S.
17	2010	Thermal stability improvement of the lanthanum aluminate/silicon interface using a thin yttrium interlayer	Liu, Z.Q.; Chiam, S.Y.; Chim, W.K. ; Pan, J.S.; Ng, C.M.
18	2003	Thermal stability dependence on states for multi-state MRAM	Zheng, Y.; Qiu, J.; Li, K.; Guo, Z.; Wu, Y.
19	Nov-2002	Thermal reaction of nickel and Si0.75Ge0.25 alloy	Pey, K.L. ; Choi, W.K. ; Chattopadhyay, S.; Zhao, H.B.; Fitzgerald, E.A.; Antoniadis, D.A.; Lee, P.S.
20	1-Nov-2010	Thermal oxidation of polycrystalline tungsten nanowire	You, G.F.; Thong, J.T.L.