Full Name
LI ERPING
Variants
Li, E.-P.
Li, E.P.
Li, E.
 
 
 
Email
elelep@nus.edu.sg
 

Publications

Results 1-20 of 33 (Search time: 0.004 seconds).

Issue DateTitleAuthor(s)
12008A 2D time domain method for electrical analysis of electronic packagesLiu, E.-X.; Wei, X.; Oo, Z.Z.; Li, E.-P. 
2Feb-2004A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnectsLi, E.-P. ; Liu, E.-X.; Li, L.-W. ; Leong, M.-S. 
32005A novel integrated approach for simulation of electromagnetic susceptibility problemJin, H.-F.; Li, E.-P. ; Liu, E.-X.
4May-2008A semi-analytical approach for system-level electrical modeling of electronic packages with large number of viasOo, Z.Z.; Liu, E.-X.; Li, E.-P. ; Wei, X.; Zhang, Y.; Tan, M.; Li, L.-W.J. ; Vahldieck, R.
52007A SPICE-compatible full-wave equivalent circuit model for printed circuit structure analysisChua, E.-K.; Li, E.-P. ; See, K.-Y.; Yin, W.
6Nov-2005A systematic coupled approach for electromagnetic susceptibility analysis of a shielded device with multilayer circuitryYuan, W.; Li, E.-P. 
72007A systematic semi-numerical approach for modeling of signal and power integrity of electronic packagesLi, E.-P. ; Liu, E.-X.; Oo, Z.Z.; Wei, X.; Zhang, Y.; Vahldieck, R.
82008An efficient equivalent circuit model for the EMC analysis of power/ground noiseWei, X.C.; Li, E.P. ; Liu, E.X.
92008An efficient method for power integrity and EMI analysis of advanced packagesLiu, E.-X.; Wei, X.; Oo, Z.Z.; Li, E.-P. 
102007An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packagesLiu, E.-X.; Wei, X.; Oo, Z.Z.; Li, E.-P. 
112003Analysis and design of reflector and horn antennas using multilevel fast multipole algorithms (MLFMA)Oo, Z.Z.; Li, L.-W. ; Li, J.-Y. ; Li, E.-P. 
12Mar-2005Analysis of finite-size coated electromagnetic bandgap structure by an efficient scattering matrix methodLi, E.-P. ; Wang, Q.-X.; Zhang, Y.-J.; Ooi, B.-L.
135-Nov-2003Analysis of signal propagation on high-speed planar interconnect systems based on full-wave and macromodeling techniquesLiu, E.-X.; Li, E.-P. ; Li, L.-W. 
14May-2005Analysis on the effectiveness of the 20-H rule for printed-circuit-board layout to reduce edge-radiated couplingMontrose, M.I.; Li, E.-P. ; Jin, H.-F.; Yuan, W.-L.
152004Application of the improved finite element-fast multipole method to large scattering problemsWei, X.C.; Li, E.P. ; Zhang, Y.J.
16Dec-2007Convolutional perfectly matched layer for weakly conditionally stable hybrid implicit and explicit-FDTD methodAhmed, I.; Li, E.-P. 
172008Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic packageOo, Z.Z.; Wei, X.-C.; Liu, E.-X.; Li, E.-P. ; Li, L.-W. 
18Nov-2005Efficient EMC simulation of enclosures with apertures residing in an electrically large platform using the MM-UTD methodWei, X.C.; Li, E.P. 
192008Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equationWei, X.-C.; Li, E.-P. ; Liu, E.-X.; Cui, X.
202004Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid methodLiu, E.; Li, E.-P. ; Li, L.-W.