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|Title:||A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages||Authors:||Li, E.-P.
|Issue Date:||2007||Citation:||Li, E.-P.,Liu, E.-X.,Oo, Z.Z.,Wei, X.,Zhang, Y.,Vahldieck, R. (2007). A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages. IEEE International Symposium on Electromagnetic Compatibility : -. ScholarBank@NUS Repository. https://doi.org/10.1109/ISEMC.2007.188||Abstract:||A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi-numerical approach based on the combination of the moment method and the scattering matrix method. © 2007 IEEE.||Source Title:||IEEE International Symposium on Electromagnetic Compatibility||URI:||http://scholarbank.nus.edu.sg/handle/10635/69102||ISBN:||1424413508||ISSN:||10774076||DOI:||10.1109/ISEMC.2007.188|
|Appears in Collections:||Staff Publications|
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