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https://doi.org/10.1116/1.1507339
| Title: | Thermal reaction of nickel and Si0.75Ge0.25 alloy | Authors: | Pey, K.L. Choi, W.K. Chattopadhyay, S. Zhao, H.B. Fitzgerald, E.A. Antoniadis, D.A. Lee, P.S. |
Issue Date: | Nov-2002 | Citation: | Pey, K.L., Choi, W.K., Chattopadhyay, S., Zhao, H.B., Fitzgerald, E.A., Antoniadis, D.A., Lee, P.S. (2002-11). Thermal reaction of nickel and Si0.75Ge0.25 alloy. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 20 (6) : 1903-1910. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1507339 | Abstract: | Thermal reactions of nickel and Si0.75Ge0.25 alloy were investigated. The silicided films were characterized by X-ray diffraction, Auger electron spectroscopy, scanning electron microscopy, transmission electron microscopy, and micro-Raman microscopy techniques. It was found that the sheet resistance of the silicided films increased abruptly for annealing temperature above 800°C. | Source Title: | Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films | URI: | http://scholarbank.nus.edu.sg/handle/10635/83191 | ISSN: | 07342101 | DOI: | 10.1116/1.1507339 |
| Appears in Collections: | Staff Publications |
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