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ELECTRICAL AND COMPUTER ENGINEERING
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ELECTRICAL AND COMPUTER ENGINEERING
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Results 1041-1060 of 15308 (Search time: 0.006 seconds).
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Issue Date
Title
Author(s)
1041
2013
The substrate and ground plane size effect on radiation pattern of 60-GHz LTCC patch antenna array
Wang, L.
;
Guo, Y.-X.
;
Wu, W.
1042
15-Jun-1998
The study of piezoelectric effect in wurtzite GaN/InGaN/AlGaN multilayer structures
Liu, W.
;
Teo, K.L.
;
Li, M.F.
;
Chua, S.J.
;
Uchida, K.
;
Tokunaga, H.
;
Akutsu, N.
;
Matsumoto, K.
1043
2007
The study of false route breakage in IEEE 802.11 based ad hoc networks
Li, X.
;
Chua, K.-C.
;
Kong, P.-Y.
1044
2005
The streamline effect in OBS networks and its application in load balancing
Phùng, M.H.
;
Chua, K.C.
;
Mohan, G.
;
Motani, M.
;
Wong, T.C.
1045
Jun-2010
The strategy of designing seek current profile to reduce acoustic noise and residual vibrations
Zhang, J.
;
Hong, F.
;
Ge, S.S.
1046
May-2003
The statistical distribution of percolation current for soft breakdown in ultrathin gate oxide
Lin, W.H.
;
Pey, K.L.
;
Dong, Z.
;
Chooi, S.Y.M.
;
Ang, C.H.
;
Zheng, J.Z.
1047
May-2003
The statistical distribution of percolation current for soft breakdown in ultrathin gate oxide
Lin, W.H.
;
Pey, K.L.
;
Dong, Z.
;
Chooi, S.Y.M.
;
Ang, C.H.
;
Zheng, J.Z.
1048
1-Jan-2020
The State of Ethnic Congregation in Singapore Today
Leong, CH
;
Teng, E
;
Ko, WW
1049
Jun-1979
The spreading resistance of an inhomogeneous slab with a disc electrode as a mixed boundary value problem
Leong, M.S.
;
Choo, S.C.
;
Tan, L.S.
1050
Sep-1982
The spreading resistance of a homogeneous slab on a high-resistivity substrate: Mixed boundary value solutions
Leong, M.S.
;
Choo, S.C.
;
Tan, L.S.
1051
2010
The singular perturbation analysis for one-dimensional poisson-nernst- planck equation
Shi, X.
;
Le, J.
;
Qin, K.
;
Zheng, Y.
1052
2019
The science of harmony: A psychophysical basis for perceptual tensions and resolutions in music
Chan, P.Y.
;
Dong, M.
;
Li, H.
1053
2008
The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding
Yu, D.
;
Lee, C.
;
Lau, J.H.
14
Jul-1978
The role of source boundary condition in spreading resistance calculations
Leong, M.S.
;
Choo, S.C.
;
Tan, L.S.
15
2009
The role of regularization parameter of subspace-based optimization method in solving inverse scattering problems
Ye, X.
;
Chen, X.
16
Aug-2007
The role of nitrogen on charge-trapping-induced Vth instability in HfAlON high-κ gate dielectric with metal and poly-Si gate electrodes
Yu, X.
;
Yu, M.
;
Zhu, C.
17
2009
The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization
Yu, D.-Q.
;
Lee, C.
;
Yan, L.L.
;
Choi, W.K.
;
Yu, A.
;
Lau, J.H.
18
2012
The role of Mg interface layer in MgO magnetic tunnel junctions with CoFe and CoFeB electrodes
Yang, H.
;
Yang, S.-H.
;
Parkin, S.
19
21-Dec-2013
The role of ions and reaction sites for electrochemical reversible charge cycling in mesoporous nickel hydroxides
Liu, J.
;
Ren, Y.
;
Dasgupta, B.
;
Tanoto, H.
;
Seng, H.L.
;
Chim, W.K.
;
Li, S.F.Y.
;
Chiam, S.Y.
20
2012
The role of government in an emerging disruptive innovation: The case of E-bike in China
Ruan, Y.
;
Hang, C.C.
;
Wang, Y.M.
;
Ma, R.F.
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