Full Name
Yida Li
(not current staff)
Variants
Li, Yida
 
 
 
Email
elelyida@nus.edu.sg
 

Publications

Results 1-10 of 10 (Search time: 0.006 seconds).

Issue DateTitleAuthor(s)
113-Apr-202023.2 A 70µW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB TransceiverLUO YUXUAN ; LI YIDA ; THEAN VOON YEW, AARON ; HENG CHUN HUAT 
220-Jul-2020A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-Based Gesture Recognition With AI at the EdgeLUO YUXUAN ; LI YIDA ; THAM CHEN KHONG ; HENG CHUN HUAT ; THEAN VOON YEW, AARON 
35-Nov-2019An 8.2- μ W 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital ConverterLUO YUXUAN ; LI YIDA ; THEAN VOON YEW, AARON ; HENG CHUN HUAT 
42-Nov-2021Hybrid-Flexible Bimodal Sensing Wearable Glove System for Complex Hand Gesture RecognitionJieming Pan ; Yida Li ; Yuxuan Luo ; Xiangyu Zhang ; Xinghua Wang ; David Liang Tai Wong ; Chun-Huat Heng ; Chen-Khong Tham ; Aaron Voon-Yew Thean 
52019Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAMSamanta, Subhranu ; Zhang, Panpan ; Han, Kaizhen ; Gong, Xiao ; Chakraborty, Sandipan ; Li, Yida ; Fong, Xuanyao 
629-May-2021Modification of thermal transport in few-layer MoS 2 by atomic-level defect engineeringYunshan Zhao ; Minrui Zheng ; Jing Wu ; Xin Guan ; Ady Suwardi ; Yida Li ; Manohar Lal ; Guofeng Xie; Gang Zhang; Lifa Zhang ; John TL Thong 
712-Aug-2022Non-destructive online seal integrity inspection utilizing autoencoder-based electrical capacitance tomography for product packaging assuranceJIEMING PAN ; Zaifeng Yang; THEAN VOON YEW, AARON ; STEPHANIE HUI KIT YAP ; ZHANG XIANGYU ; Li Yida ; LUO YUXUAN ; Evgeny Zamburg ; Tham Chen Khong ; En-Xiao Liu; Zefeng Xu
825-Oct-2020Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging AssuranceJIEMING PAN ; Li Yida ; LUO YUXUAN ; ZHANG XIANGYU ; Zaifeng Yang; Wong Liang Tai,David ; Niu Xuhua ; Tham Chen Khong ; THEAN VOON YEW, AARON 
928-Jun-2021Transfer learning-based artificial intelligence-integrated physical modeling to enable failure analysis for 3 nanometer and smaller silicon-based CMOS transistorsJIEMING PAN ; LOW KAIN LU ; JOYDEEP GHOSH ; Senthilnath Jayavelu; Md Meftahul Ferdaus; Shang Yi Lim; Evgeny Zamburg ; Li Yida ; TANG BAOSHAN ; WANG XINGHUA ; LEONG JIN FENG ; Savitha Ramasamy; Tonio Buonassisi; Tham Chen Khong ; THEAN VOON YEW, AARON 
101-Jun-2022Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computingTang, Baoshan ; Veluri, Hasita; Li, Yida ; Yu, Zhi Gen; Waqar, Moaz; Leong, Jin Feng ; Sivan, Maheswari ; Zamburg, Evgeny ; Zhang, Yong-Wei ; Wang, John ; Thean, Aaron V-Y