Please use this identifier to cite or link to this item: https://doi.org/10.1109/SENSORS47125.2020.9278879
Title: Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance
Authors: JIEMING PAN 
Li Yida 
LUO YUXUAN 
ZHANG XIANGYU 
Zaifeng Yang
Wong Liang Tai,David 
Niu Xuhua 
Tham Chen Khong 
THEAN VOON YEW, AARON 
Issue Date: 25-Oct-2020
Publisher: IEEE sensors
Citation: JIEMING PAN, Li Yida, LUO YUXUAN, ZHANG XIANGYU, Zaifeng Yang, Wong Liang Tai,David, Niu Xuhua, Tham Chen Khong, THEAN VOON YEW, AARON (2020-10-25). Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance. IEEE SENSORS. ScholarBank@NUS Repository. https://doi.org/10.1109/SENSORS47125.2020.9278879
Rights: Attribution-NoDerivatives 4.0 International
Source Title: IEEE SENSORS
URI: https://scholarbank.nus.edu.sg/handle/10635/218156
ISSN: 2168-9229
DOI: 10.1109/SENSORS47125.2020.9278879
Rights: Attribution-NoDerivatives 4.0 International
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