Please use this identifier to cite or link to this item:
https://doi.org/10.1109/SENSORS47125.2020.9278879
| Title: | Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance | Authors: | JIEMING PAN Li Yida LUO YUXUAN ZHANG XIANGYU Zaifeng Yang Wong Liang Tai,David Niu Xuhua Tham Chen Khong THEAN VOON YEW, AARON |
Issue Date: | 25-Oct-2020 | Publisher: | IEEE sensors | Citation: | JIEMING PAN, Li Yida, LUO YUXUAN, ZHANG XIANGYU, Zaifeng Yang, Wong Liang Tai,David, Niu Xuhua, Tham Chen Khong, THEAN VOON YEW, AARON (2020-10-25). Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance. IEEE SENSORS. ScholarBank@NUS Repository. https://doi.org/10.1109/SENSORS47125.2020.9278879 | Rights: | Attribution-NoDerivatives 4.0 International | Source Title: | IEEE SENSORS | URI: | https://scholarbank.nus.edu.sg/handle/10635/218156 | ISSN: | 2168-9229 | DOI: | 10.1109/SENSORS47125.2020.9278879 | Rights: | Attribution-NoDerivatives 4.0 International |
| Appears in Collections: | Staff Publications Elements |
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| File | Description | Size | Format | Access Settings | Version | |
|---|---|---|---|---|---|---|
| SEALIN~1.PDF | 654.4 kB | Adobe PDF | OPEN | None | View/Download |
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