1. ScholarBank@NUS

Pey Kin Leong

rp03121

Collaboration Map View Statistics Email Alert RSS Feed

Profile

Full Name
Pey Kin Leong
Variants
PEY, KIN-LEONG
PEY, KIN L.
LEONG, KIN
Pey, Kin Leong
PEY, KIN LEONG
Pey, K.L.
 
Main Affiliation
 
Faculty
 

Publications

Refined By:
Department:  ELECTRICAL AND COMPUTER ENGINEERING
Department:  PHYSICS
Department:  ELECTRICAL & COMPUTER ENGINEERING

Results 1-20 of 36 (Search time: 0.008 seconds).

Issue DateTitleAuthor(s)
12001A comparative study of nickel silicide formation using a titanium cap layer and a titanium interlayerTan, W.L.; Pey, K.L. ; Chooi, S.Y.M. ; Ye, J.H.
2Dec-2001Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnectsChu, L.W.; Chim, W.K. ; Pey, K.L. ; Yeo, J.Y.K.; Chan, L.
31-Aug-2002Control of transient enhanced diffusion of boron after laser thermal processing of preamorphized siliconChong, Y.F.; Pey, K.L. ; Wee, A.T.S. ; Osipowicz, T. ; See, A.; Chan, L.
415-Feb-2002Effect of a titanium cap in reducing interfacial oxides in the formation of nickel silicideTan, W.L.; Pey, K.L. ; Chooi, S.Y.M.; Ye, J.H.; Osipowicz, T. 
531-Dec-2001Effect of current direction on the lifetime of different levels of Cu dual-damascene metallizationGan, C.L.; Thompson, C.V.; Pey, K.L. ; Choi, W.K. ; Tay, H.L.; Yu, B.; Radhakrishnan, M.K.
6Sep-2002Effect of ion implantation on layer inversion of Ni silicided poly-SiLee, P.S.; Pey, K.L. ; Mangelinck, D.; Ding, J. ; Chi, D.Z.; Osipowicz, T. ; Dai, J.Y.; Chan, L.
72001Effect of transmission line pulsing of interconnects investigated using combined low-frequency noise and resistance measurementsChu, L.W.; Chim, W.K. ; Pey, K.L. ; See, A. 
8Mar-2002Effects of post-deposition anneal on the electrical properties of Si3N4 gate dielectricLin, W.H.; Pey, K.L. ; Dong, Z.; Chooi, S.Y.-M.; Zhou, M.S.; Ang, T.C.; Ang, C.H.; Lau, W.S.; Ye, J.H.
9Jan-2002Enhanced stability of Ni monosilicide on MOSFETs poly-Si gate stackLee, P.S.; Mangelinck, D.; Pey, K.L. ; Ding, J. ; Chi, D.Z.; Osipowicz, T. ; Dai, J.Y.; See, A.
102002Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect treesGan, C.L.; Thompson, C.V.; Pey, K.L. ; Choi, W.K. ; Wei, F.; Yu, B.; Hau-Riege, S.P.
11Apr-2002Impacts of buffer oxide layer in nitride/oxide stack gate dielectrics on the device performance and dielectric reliabilityLin, W.H.; Pey, K.L. ; Dong, Z.; Lim, V.S.K.; Chooi, S.Y.M.; Zhou, M.S.; Ang, C.H.; Ang, T.C.; Lau, W.S.
1220-May-2003Incorporation of dielectric layer onto SThM tips for direct thermal analysisHU, CHANG CHAUN; PEY, KIN LEONG ; CHONG, YUNG FU; KIN, CHIM WAI ; NEUZIL, PAVEL; CHAN, LAP
131-Jul-2002Interfacial reactions of Ni on Si 1-xGe x (x=0.2,0.3) at low temperature by rapid thermal annealingZhao, H.B.; Pey, K.L. ; Choi, W.K. ; Chattopadhyay, S.; Fitzgerald, E.A.; Antoniadis, D.A.; Lee, P.S.
1411-Nov-2002Laser-induced amorphization of silicon during pulsed-laser irradiation of Tin/Ti/polycrystalline silicon/SiO2/siliconChong, Y.F.; Pey, K.L. ; Wee, A.T.S. ; Thompson, M.O.; Tung, C.H.; See, A.
15Dec-2001Laser-induced titanium disilicide formation for submicron technologiesChong, Y.F.; Pey, K.L. ; Wee, A.T.S. ; See, A. ; Shen, Z.X. ; Tung, C.-H. ; Gopalakrishnan, R. ; Lu, Y.F. 
16Mar-2002Layer inversion of Ni(Pt)Si on mixed phase Si filmsLee, P.S.; Pey, K.L. ; Mangelinck, D.; Ding, J. ; Osipowicz, T. ; See, A.
172002Length effects on the reliability of dual-damascene Cu interconnectsWei, F.; Gan, C.L.; Thompson, C.V.; Clement, J.J.; Hau-Riege, S.P.; Pey, K.L. ; Choi, W.K. ; Tay, H.L.; Yu, B.; Radhakrishnan, M.K.
1824-Jan-2012Method for fabricating semiconductor devices with shallow diffusion regionsTAN, DEXTER XUEMING; COLOMBEAU, BENJAMIN; ONG, CLARK KUANG KIAN; YEONG, SAI HOOI; NG, CHEE MANG ; PEY, KIN LEONG 
1915-Feb-2011Method for forming a shallow junction region using defect engineering and laser annealingONG, KUANG KIAN; YEONG, SAI HOOI; PEY, KIN LEONG ; CHAN, LAP; CHONG, YUNG FU
2030-Jan-2001Method to fabricate a double-polysilicon gate structure for a sub-quarter micron self-aligned-titanium silicide processPEY, KIN-LEONG ; HO, CHAW SING; CHAN, LAP