Please use this identifier to cite or link to this item:
https://scholarbank.nus.edu.sg/handle/10635/70090
| Title: | Effect of transmission line pulsing of interconnects investigated using combined low-frequency noise and resistance measurements | Authors: | Chu, L.W. Chim, W.K. Pey, K.L. See, A. |
Issue Date: | 2001 | Citation: | Chu, L.W.,Chim, W.K.,Pey, K.L.,See, A. (2001). Effect of transmission line pulsing of interconnects investigated using combined low-frequency noise and resistance measurements. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : 97-102. ScholarBank@NUS Repository. | Abstract: | A novel technique of combining 1/f noise and resistance measurements for characterizing electrostatic discharge (ESD) induced voiding damage in aluminium interconnects is reported. The ESD stress was performed using the transmission line pulsing (TLP) technique. Samples of different linewidths, with and without an overlying passivation, were studied. | Source Title: | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA | URI: | http://scholarbank.nus.edu.sg/handle/10635/70090 |
| Appears in Collections: | Staff Publications |
Show full item record
Files in This Item:
There are no files associated with this item.
Google ScholarTM
Check
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.