INSTITUTE OF MICROELECTRONICS

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	Issue Date	Title	Author(s)
1	1993	Wirebound deformation during molding of IC packages	Tay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.
2	Mar-1995	Wirebond deformation during molding of IC packages	Tay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.
3	10-May-2005	Wafer level super stretch solder	WONG, EE HUA ; RAJOO, RANJAN; TEO, POI SIONG
4	Sep-1995	Viterbi-type algorithm for efficient estimation of M-PSK sequences over the Gaussian channel with unknown carrier phase	Kam, Pooi Yuen ; Sinha, Pranesh
5	1998	Via design optimization for high speed device packaging	Low, Hong-Guan; Iyer, Mahadevan K. ; Ooi, Ban-Leong ; Leong, Mook-Seng
6	1998	Via design optimization for high speed device packaging	Low, Hong-Guan; Iyer, Mahadevan K. ; Ooi, Ban-Leong ; Leong, Mook-Seng
7	Feb-2012	Ultralow broadband optical reflection of silicon nanostructured surfaces coupled with antireflection coating	Liu, Y. ; Hong, M.
8	2002	Tunable Oxide-Bypassed VDMOS (OBVDMOS): Breaking the silicon limit for the second generation	Liang, Y.C. ; Yang, X.; Samudra, G.S. ; Gan, K.P.; Liu, Y.
9	2006	Transport characteristics of Si nanowires in bulk silicon and SOI wafers	Agarwal, A.; Singh, N.; Liow, T.-Y.; Kumar, R. ; Balasubramanian, N. ; Kwong, D.L.
10	1995	Transmission electron microscopy study of microstructure and [112̄0]//[001] polycrystalline epitaxy of CoNiCr/Cr bilayer films	Tang, L.; Lu, D. ; Thomas, G.
11	1997	Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylate	Wang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.
12	Dec-2001	Surface modification of poly(tetrafluoroethylene) films by plasma pre-activation and plasma polymerization of glycidyl methacrylate	Zou, X.P.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B.
13	1999	Surface graft copolymerization of poly(tetrafluoroethylene) film with simultaneous lamination to copper foil	Kang, E.T. ; Liu, Y.X.; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.
14	1999	Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper	Liu, Y.X.; Kang, E.T. ; Neoh, K.G. ; Zhang, J.F.; Cui, C.Q. ; Lim, T.B.
15	15-May-1995	Surface and electrical studies of CuO:V2O5 thin films	Gopalakrishnan, R. ; Chowdari, B.V.R. ; Tan, K.L. ; Radhakrishnan, K.
16	1995	Surface analysis and application in magnetic hard disk media	Gopalakrishnan, R.
17	1998	Superiority of N2O plasma annealing over O2 plasma annealing for amorphous tantalum pentoxide (Ta2O5) films	Lau, Wai Shing ; Perera, Merinnage Tamara Chandima; Babu, Premila; Ow, Aik Keong; Han, Taejoon; Sandler, Nathan P.; Tung, Chih Hang ; Sheng, Tan Tsu ; Chu, Paul K.
18	1997	Study on excitonic absorptions in wurztite GaN by photovoltaic spectra at room temperature	Liu, W.; Li, M.F. ; Chua, S.J. ; Zhang, Y.H. ; Uchida, K.
19	22-Aug-1997	Structures, properties and responses to heat treatment of melt-spun Cu - Y alloys	Li, Y. ; Ng, S.C. ; Tan, L.K.; Lu, D.
20	2004	Structure of the breakdown spot during progressive breakdown of ultra-thin gate oxides	Palumbo, F.; Lombardo, S.; Pey, K.L.; Tang, L.J.; Tung, C.H.; Lin, W.H.; Radhakrishnan, M.K. ; Falci, G.