INSTITUTE OF MICROELECTRONICS

Organization name
INSTITUTE OF MICROELECTRONICS


Results 21-40 of 138 (Search time: 0.003 seconds).

Issue DateTitleAuthor(s)
211995Structural properties of amorphous silicon carbide films by plasma-enhanced chemical vapor depositionChoi, W.K. ; Chan, Y.M.; Ling, C.H. ; Lee, Y.; Gopalakrishnan, R. ; Tan, K.L. 
222004Structural analysis of breakdown in ultrathin gate dielectrics using transmission electron microscopyPey, K.L.; Tung, C.H.; Tang, L.J.; Ranjan, R.; Radhakrishnan, M.K. ; Lin, W.H.; Lombardo, S.; Palumbo, F.
2317-Oct-2006Software instructions utilizing a hardwired circuitALDRIDGE, CHRISTOPHER ; PRADHAN, MRIDULA; LEE, CHONG YEE 
24Mar-1995Small area X-ray photoelectron spectroscopy (SAXPS) analysis of microscopic contamination in semiconductor materials and processesMarks, M.R. ; Kintrup, L.; Bittigau, K.
2515-Feb-1996Skin-core morphology of in situ composites based on polycarbonate and a liquid crystalline polymerHu, X.; Lin, Q.; Yee, A.F.; Lu, D. 
266-Oct-2003Size difference in dielectric-breakdown-induced epitaxy in narrow n- and p-metal oxide semiconductor field effect transistorsPey, K.L.; Tung, C.H.; Tang, L.J.; Lin, W.H.; Radhakrishnan, M.K. 
271995Simulation of three-dimensional wirebond deformation during transfer moldingTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. 
28Aug-1993Semiconductor parameters extraction using cathodoluminescence in the scanning electron microscopeChan, Daniel S.H. ; Pey, Kin Leong ; Phang, Jacob C.H. 
29Aug-1993Semiconductor parameters extraction using cathodoluminescence in the scanning electron microscopeChan, Daniel S.H. ; Pey, Kin Leong ; Phang, Jacob C.H. 
30May-2004Schottky-barrier S/D MOSFETs with high-K gate dielectrics and metal-gate electrodeZhu, S. ; Yu, H.Y. ; Whang, S.J. ; Chen, J.H. ; Shen, C.; Zhu, C. ; Lee, S.J. ; Li, M.F. ; Chan, D.S.H. ; Yoo, W.J. ; Du, A.; Tung, C.H. ; Singh, J.; Chin, A.; Kwong, D.L.
3112-Dec-1995Programmable current source correction circuitSINGH, RAMINDER J. ; BHATT, ANSUYA P. ; TAN, KHEN S. 
321999Predicting plasma charging damage in ultra thin gate oxide by using nondestructive DCIV techniqueGuan, Hao; Li, M.F. ; Zhang, Yaohui ; Cho, B.J. ; Jie, B.B.; Xie, Joseph; Wang, J.L.F. ; Yen, Andrew C. ; Sheng, George T.T.; Dong, Zhong; Li, Weidan
331999Predicting plasma charging damage in ultra thin gate oxide by using nondestructive DCIV techniqueGuan, Hao; Li, M.F. ; Zhang, Yaohui ; Cho, B.J. ; Jie, B.B.; Xie, Joseph; Wang, J.L.F. ; Yen, Andrew C. ; Sheng, George T.T.; Dong, Zhong; Li, Weidan
34May-1994Predicting delamination in plastic IC packages and determining suitable mold compound propertiesTay, A.A.O. ; Tan, G.L. ; Lim, T.B. 
35May-1997Precision transmission electron microscopy sample preparation using a focused ion beam by extraction methodSheng, T.T. ; Goh, G.P.; Tung, C.H. ; Wang, L.F. 
36May-2011Polymer jet printing of SU-8 micro-dot patterns on Si surface: Optimization of tribological propertiesTay, N.B. ; Minn, M. ; Sinha, S.K. 
37Oct-2001Plasma polymerization and deposition of glycidyl methacrylate on Si(100) surface for adhesion improvement with polyimideZou, X.P.; Kang, E.T. ; Neoh, K.G.; Zhang, Y. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.
382002Physical analysis of Ti-migration in 33 Å gate oxide breakdownPey, K.L. ; Tung, C.H. ; Lin, W.H.; Radhakrishnan, M.K. 
391999Performance of titanium and amorphous germanium microbolometer infrared detectorsRamakrishna, M.V.S.; Karunasiri, G. ; Sridhar, U. ; Chen, G. 
408-Aug-2000Passivation of copper interconnect surfaces with a passivating metal layerCHAN, LAP; YAP, KUAN PEI; TEE, KHENG CHOK; IP, FLORA S.; LOH, WYE BOON