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Tay Ah Ong,Andrew

rp08084

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Full Name
Tay Ah Ong,Andrew
(not current staff)
Variants
Tay, A.
Tay, A.O.A.
Tay, Ah Ong Andrew
Tay, A.A.O.
TAY, ANDREW AH ONG
Tay, A.O.
Tay, Andrew A.O.
Ong, A.T.A.
 
Main Affiliation
 
Faculty
 
Email
mpetayao@nus.edu.sg
 

Publications

Results 181-200 of 211 (Search time: 0.008 seconds).

Issue DateTitleAuthor(s)
1011995Simulation of three-dimensional wirebond deformation during transfer moldingTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. 
22005Simulation-based design optimization of solder joint reliability of wafer level copper column interconnectsWei, S.; Tay, A.A.O. ; Vedantam, S. 
32012Singapore modules-optimised PV modules for the tropicsWalsh, T.M. ; Xiong, Z.; Khoo, Y.S.; Tay, A.A.O. ; Aberle, A.G. 
414-Feb-2008Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite soldersKumar, K.M.; Kripesh, V.; Tay, A.A.O. 
52006Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packagingMohan Kumar, K.; Kripesh, V.; Tay, A.A.O. 
61988Some theories on the effects of atmospheric humidity on tool forces and chip formation in turningSeah, K.H.W. ; Tay, A.O. 
72012Stress analysis of silicon wafer based photovoltaic modules in operationYixian, L.; Tay, A.A.O. 
82013Stress analysis of silicon wafer-based photovoltaic modules under IEC 61215 mechanical load testLee, Y.; Tay, A.A.O. 
92013Structural and morphological qualities of InGaN grown via elevated pressures in MOCVD on AlN/Si(111) substratesHo, J.W.; Zhang, L. ; Wee, Q.; Tay, A.A.O. ; Heuken, M.; Chua, S.-J. 
102007Structural design and optimization of 65nm Cu/low-k flipchip packageOng, J.; Zhang, X.; Kripesh, V.; Lim, Y.K.; Yeo, D.; Chan, K.C.; Tan, J.B.; Hsia, L.C.; Sohn, D.K.; Tay, A. 
111999Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflowTay, A.A.O. ; Goh, K.Y.
1210-May-2006Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applicationsKumar, K.M.; Kripesh, V.; Shen, L.; Tay, A.A.O. 
132006Super stretched solder interconnects for wafer level packagingRajoo, R.; Wong, E.H.; Lim, S.S.; Hnin, W.Y.; Seah, S.K.W.; Tay, A.A.O. ; Iyer, M.; Tummala, R.R.
142004Surface micromachined pressure sensing structures with biocompatible interfaceLiao, E.; Ang, S. ; Ong, A.T.A. ; Liang, Y.C. ; Jin, A.Y.U. 
1519-Aug-2003Surface modification of polyimide films via plasma-enhanced chemical vapor deposition of thin silica and nitride filmsLi, H.; Sharma, R.K.; Zhang, Y. ; Tay, A.A.O. ; Kang, E.T. ; Neoh, K.G. 
163-Apr-2006Surface NH 3 anneal on strained Si 0.5Ge 0.5 for metal-oxide-semiconductor applications with HfO 2 as gate dielectricHuang, J.; Wu, N.; Zhang, Q.; Zhu, C. ; Li, M.F. ; Tay, A.A.O. ; Cheng, Z.-Y.; Leitz, C.W.; Lochtefeld, A.
17Feb-2013Testing of two different types of photovoltaic-thermal (PVT) modules with heat flow pattern under tropical climatic conditionsDubey, S.; Tay, A.A.O. 
182005The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflowTay, A.A.O. ; Ma, Y.Y. ; Hu, G.J.
192007The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon waferArefin, S.; Li, X.P. ; Cai, M.B.; Rahman, M. ; Liu, K. ; Tay, A. 
20Sep-1991The importance of allowing for the variation of thermal properties in the numerical computation of temperature distribution in machiningTay, A.A.O.