1. ScholarBank@NUS

Tay Ah Ong,Andrew

rp08084

Collaboration Map View Statistics Email Alert RSS Feed

Profile

Full Name
Tay Ah Ong,Andrew
(not current staff)
Variants
Tay, A.
Tay, A.O.A.
Tay, Ah Ong Andrew
Tay, A.A.O.
TAY, ANDREW AH ONG
Tay, A.O.
Tay, Andrew A.O.
Ong, A.T.A.
 
Main Affiliation
 
Faculty
 
Email
mpetayao@nus.edu.sg
 

Publications

Results 41-60 of 211 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
412007An experimental study of spray cooling of a flip chipTay, A.A.O. ; Lin, C.C.T.; Yang, G.X. ; Somasundaram, S.
225-Apr-2007An investigation of the synthesis and characterization of copper samples for use in interconnect applicationsGupta, M. ; Tay, A.A.O. ; Vaidyanathan, K.; Srivatsan, T.S.
31998Analysis of delamination in IC packages using a new variable-order singular boundary elementTay, A.A.O. ; Lee, K.H. ; Lim, K.M. 
42009Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?Guojun, H.; Jing-En, L.; Baraton, X.; Tay, A.A.O. 
5Dec-1994Analysis of stresses in cross-ply composite laminates containing distributed transverse cracksTay, T.E. ; Lim, E.H. ; Tay, A.A.O. 
61999Analytical study on a MEMS micro-cooling system for cooling of flip chipsTay, Andrew A.O. ; Tay, Francis E.H. ; Li, Wenjie
72005Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflowHu, G.; Tay, A.A.O. 
82000Application of the model of leaf and glaskin to estimating the 3D elastic properties of knitted-fabric-reinforced compositesRamakrishna, S. ; Huang, Z.M. ; Teoh, S.H. ; Tay, A.A.O. ; Chew, C.L. 
92004Bed of Nails - 100 microns pitch wafer level interconnections processRao, V.S.; Tay, A.A.O. ; Kripesh, V.; Lim, C.T. ; Yoon, S.W.
102008Bed of nails - 100-μm-pitch wafer-level interconnections processVempati, S.R.; Tay, A.A.O. ; Kripesh, V.; Yoon, S.W.
112005Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devicesRao, V.S.; Kripesh, V.; Yoon, S.W.; Witarsa, D.; Tay, A.A.O. 
121998Boundary element analysis of delamination in IC packagesTay, A.A.O. ; Lee, K.H. ; Lim, K.M. 
13Jan-1992Calculation of temperature distributions in machining using a hybrid finite-element-boundary-element methodTay, A.A.O. ; Lee, K.H. 
142004Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packagesTay, A.A.O. 
151999Characterization of a Knitted Fabric Reinforced Elastomer CompositeHuang, Z.M.; Ramakrishna, S. ; Dinner, H.P.; Tay, A.A.O. 
1619-Aug-2003Characterization of electrolessly deposited copper and nickel nanofilms on modified Si(100) surfaceZhang, Y. ; Ang, S.S. ; Tay, A.A.O. ; Xu, D.; Kang, E.T. ; Neoh, K.G. ; Chong, L.P.; Huan, A.C.H.
172012Cohesive zone modeling of 3D delamination in encapsulated silicon devicesHo, S.L.; Joshi, S.P. ; Tay, A.A.O. 
182005Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnectsLiao, E.B.; Tay, A.A.O. ; Ang, S.S.T.; Feng, H.H.; Nagarajan, R.; Kripesh, V.; Kumar, R.; Mahadevan, I.
191996Computer simulation of viscoelastic flow at the entry regionLoh, K.W.L.; Teoh, S.H. ; Tay, A.A.O. 
202002Cooling of electronic components with free jet impingement boilingTay, A.A.O. ; Xue, H.; Yang, C.