Full Name
ANG,SIMON SAW-TEONG
Variants
Ang, S.S.
Ang, S.
ANG, SIMON SAW-TEONG
ANG, SIMON S.
ANG, SIMON S
 
 
 
Email
bieangs@nus.edu.sg
 

Publications

Results 1-13 of 13 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
119-Aug-2003Characterization of electrolessly deposited copper and nickel nanofilms on modified Si(100) surfaceZhang, Y. ; Ang, S.S. ; Tay, A.A.O. ; Xu, D.; Kang, E.T. ; Neoh, K.G. ; Chong, L.P.; Huan, A.C.H.
2Jun-2004Development of a solid propellant microthruster with chamber and nozzle etched on a wafer surfaceZhang, K.L.; Chou, S.K. ; Ang, S.S. 
3Apr-2004MEMS-based solid propellant microthruster design, simulation, fabrication, and testingZhang, K.; Chou, S.K. ; Ang, S.S. 
426-Jul-2006METHOD AND APPARATUS FOR DETECTING ANALYTE WITH FILTERLIU, WEN-TSO ; ANG, SIMON S ; ZHU, LIANG 
521-Apr-2005METHOD AND APPARATUS FOR DETECTING ANALYTE WITH FILTERLIU, WEN-TSO ; ANG, SIMON S ; ZHU, LIANG 
62-Mar-2006Method and apparatus for detecting analyte with filterLIU, WEN-TSO ; ANG, SIMON S. ; ZHU, LINNG
7May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
8May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
9May-2006Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packagingLiao, E.B.; Tay, A.A.O. ; Ang, S.S. ; Feng, H.H.; Nagarajan, R.; Kripesh, V.
107-Sep-2006Planar microspring integrated circuit chip interconnection to next levelTAY, ANDREW AH ONG ; ANG, SIMON SAW-TEONG ; LIAO, EBIN
115-Dec-2002Selective electroless plating of copper on (100)-oriented single crystal silicon surface modified by UV-induced coupling of 4-vinylpyridine with the H-Terminated siliconXu, D.; Kang, E.T. ; Neoh, K.G. ; Zhang, Y. ; Tay, A.A.O. ; Ang, S.S. ; Lo, M.C.Y.; Vaidyanathan, K.
122004Surface micromachined pressure sensing structures with biocompatible interfaceLiao, E.; Ang, S. ; Ong, A.T.A. ; Liang, Y.C. ; Jin, A.Y.U. 
13Mar-2003Surface passivation of (100)-oriented GaAs with ultrathin fluoropolymer films deposited by radio frequency magnetron sputtering of poly(tetrafluoroethylene)Zhang, Y. ; Kang, E.T. ; Neoh, K.G. ; Ang, S.S. ; Huan, A.C.H.