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Tay Ah Ong,Andrew

rp08084

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Full Name
Tay Ah Ong,Andrew
(not current staff)
Variants
Tay, A.
Tay, A.O.A.
Tay, Ah Ong Andrew
Tay, A.A.O.
TAY, ANDREW AH ONG
Tay, A.O.
Tay, Andrew A.O.
Ong, A.T.A.
 
Main Affiliation
 
Faculty
 
Email
mpetayao@nus.edu.sg
 

Publications

Results 1-20 of 211 (Search time: 0.007 seconds).

Issue DateTitleAuthor(s)
120133D vs 2D modeling of the effect of die size on delamination in encapsulated IC packagesHo, S.L.; Tay, A.A.O. 
2Apr-2010A chip scale nanofluidic pump using electrically controllable hydrophobicityLiu, H.; Dharmatilleke, S.; Tay, A.A.O. 
32014A dual-character InGaN/GaN multiple quantum well device for electroluminescence and photovoltaic absorption of near-mutually exclusive wavelengthsHo, J.-W.; Dolmanan, S.-B.; Tay, C.B. ; Wee, Q.; Tay, A.A.O. ; Chua, S.-J. 
42006A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packagesZhao, B.; Tay, A.A.O. ; Prakash, T. 
52009A hydrophobicity controlled nanofluidic pumpLiu, H.; Dharmatilleke, S.; Tay, A.A.O. 
61997A J-integral criterion for delamination of bi-material interfaces incorporating hygrothermal stressLin, T.Y.; Tay, A.A.O. 
72004A low cost polymer based piezo-actuated micropump for drug delivery systemLiu, H. ; Tay, A.A.O. ; Wan, S.Y.M.; Lim, G.C.
82006A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packagingLiao, E.B.; Tay, A.A.O. ; Ang, S.S.T.; Feng, H.H.; Nagarajan, R.; Kripesh, V.; Kumar, R.; Iyer, M.K.
92003A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packagesTay, A.A.O. ; Phang, J.S. ; Wong, E.H.; Ranjan, R.
10Mar-2014A new accurate closed-form analytical solution for junction temperature of high-powered devicesLing, J.H.L.; Tay, A.A.O. 
112005A new modified crack surface displacement extrapolation method for analysis of package delaminationGuojun, H.; Tay, A.A.O. 
12Jan-2005A new variable-order singular boundary element for calculating stress intensity factors in three-dimensional elasticity problemsZhou, W.; Lim, K.M. ; Lee, K.H. ; Tay, A.A.O. 
1330-Sep-2002A new variable-order singular boundary element for two-dimensional stress analysisLim, K.M. ; Lee, K.H. ; Tay, A.A.O. ; Zhou, W.
14Aug-2007A novel test strategy for fine pitch wafer-level packaged devicesJayabalan, J.; Rotaru, M.D.; Rao, V.S.; Kripesh, V.; Iyer, M.K.; Tay, A.A.O. ; Ooi, B.-L. ; Leong, M.-S. 
152011A numerical analysis of penny-shaped delaminations in an encapsulated silicon moduleHo, S.L.; Tay, A.A.O. 
162004A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperaturesTay, A.A.O. ; Ma, Y. ; Nakamura, T.; Ong, S.H.
171988A numerical method for determining tensile stress-strain properties of plastics from total elongation measurementsTay, A.O. ; Teoh, S.H. 
182009A numerical study of 3D interfacial delamination in PQFP packagesHo, S.L.; Tay, A.A.O. 
192004A numerical study of fatigue life of copper column interconnections in wafer level packagesSun, W.; Tay, A.A.O. ; Vedantam, S. 
202002A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packagesTay, A.A.O. ; Zhu, H.