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Tay Ah Ong,Andrew

rp08084

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Full Name
Tay Ah Ong,Andrew
(not current staff)
Variants
Tay, A.
Tay, A.O.A.
Tay, Ah Ong Andrew
Tay, A.A.O.
TAY, ANDREW AH ONG
Tay, A.O.
Tay, Andrew A.O.
Ong, A.T.A.
 
Main Affiliation
 
Faculty
 
Email
mpetayao@nus.edu.sg
 

Publications

Results 121-140 of 211 (Search time: 0.004 seconds).

Issue DateTitleAuthor(s)
1212008Measurement of heat transfer coefficient in spray cooling of a flip chipTay, A.A.O. ; Somasundaram, S.
1221999Measurement of interface toughness as a function of temperature, moisture concentration and mode mixityTay, A.A.O. ; Yi Ma, Y. ; Huat Ong, S.; Nakamura, T.
32012Measurement of MMIC gate temperature using infrared and Thermoreflectance thermographyLing, J.H.L.; Tay, A.A.O. ; Choo, K.F.; Chen, W.; Kendig, D.
42010Measurement of thermal resistance of TIMs, heat sinks and interfaces in thermal management systems for IC packagesSomasundaram, S.; Tay, A.A.O. 
52005Mechanical behavior of Cu/low-k stacks with different barrier layersSekhar, V.N.; Balakumar, S.; Tay, A.A.O. ; Sinha, S.K. 
6Mar-2004Mechanical characterization of the heat affected zone of gold wirebonds using nanoindentationShah, M.; Zeng, K.; Tay, A.A.O. 
7Mar-2004Mechanical properties of nanocrystalline copper and nickelSiow, K.S. ; Tay, A.A.O. ; Oruganti, P.
82006Mechanics of interfacial delamination in IC packages undergoing solder reflowTay, A.A.O. 
91997Mechanics of interfacial delamination under hygrothermal stresses during reflow solderingLin, T.Y.; Tay, A.A.O. 
10Jan-1992Micro-computer-based optimization of the surface grinding processWen, X.M.; Tay, A.A.O. ; Nee, A.Y.C. 
111999Micromechanical approach to the tensile strength of a knitted fabric compositeHuang, Z.M. ; Ramakrishna, S. ; Tay, A.O.A. 
12Sep-1999Micromechanical modeling approach to the mechanical properties of textile elastomeric compositesHuang, Z.M. ; Ramakrishna, S. ; Tay, A.A.O. 
132012Modeling of delamination in IC packagesTay, A.A.O. 
142007Modeling of dry self-assembly process for mass rapid assembling microchips on silicon substrateGao, X. ; Tay, A.A.O. ; Kripesh, V.
15Sep-2005Modeling of interfacial delamination in plastic IC packages under hygrothermal loadingTay, A.A.O. 
162004Modeling of solder joint failure due to PCB bending during drop impactJie, G.; Lim, C.T. ; Tay, A.A.O. 
172000Modeling of viscoelastic effects on interfacial delamination in IC packagesXiong, Z.; Tay, A.A.O. 
18Apr-2000Modeling the stress/strain behavior of a knitted fabric-reinforced elastomer compositeHuang, Z.M.; Ramakrishna, S. ; Tay, A.A.O. 
191996Moisture diffusion and heat transfer in plastic IC packagesTay, A.A.O. ; Lin, T.Y.
20Jun-1996Moisture diffusion and heat transfer in plastic IC packagesTay, A.A.O. ; Lin, T.