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Tay Ah Ong,Andrew

rp08084

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Full Name
Tay Ah Ong,Andrew
(not current staff)
Variants
Tay, A.
Tay, A.O.A.
Tay, Ah Ong Andrew
Tay, A.A.O.
TAY, ANDREW AH ONG
Tay, A.O.
Tay, Andrew A.O.
Ong, A.T.A.
 
Main Affiliation
 
Faculty
 
Email
mpetayao@nus.edu.sg
 

Publications

Results 141-160 of 211 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
1412011Moisture diffusion modeling and its impact on fracture mechanics parameters with regard to a PQFPHo, S.L.; Tay, A.A.O. 
1421998Moisture-induced interfacial delamination growth in plastic IC packages during solder reflowTay, A.A.O. ; Lin, T.Y.
1432004Nano-particle reinforced solders for fine pitch applicationsMohankumar, K.; Tay, A.A.O. ; Kripesh, V.
144Apr-2005Nanoindentation study of nanocrystalline nickelJayaganthan, R. ; Mohankumar, K.; Tay, A.A.O. 
1452006Nanoindentation study of sputtered Al-Cu thin films for interconnect applicationsKumar, A.; Jayaganthan, R.; Chandra, R.; Chawla, V.; Tay, A.A.O. 
1462004Nanoindentation study of the Pb-free solders in fine pitch interconnectsMohankumar, K.; Tay, A.A.O. ; Kripesh, V.
1472004Nanoindentation study of the sputtered Cu thin films for interconnect applicationsSrinivasarao, V.; Jayaganthan, R. ; Sekhar, V.N.; Mohankumar, K.; Tay, A.A.O. ; Kripesh, V.
14815-May-2006Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applicationsKumar, K.M.; Kripesh, V.; Shen, L.; Zeng, K. ; Tay, A.A.O. 
1492004New paradigm in IC-package interconnections by reworkable nano-interconnectsAggarwal, A.O.; Raj, P.M.; Abothu, I.R.; Sacks, M.D.; Tay, A.A.O. ; Tummala, R.R.
150May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
151May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
152Aug-2012Novel development of the micro-tensile test at elevated temperature using a test structure with integrated micro-heaterAng, W.C.; Kropelnicki, P.; Soe, O.; Ling, J.H.L.; Randles, A.B.; Hum, A.J.W.; Tsai, J.M.L.; Tay, A.A.O. ; Leong, K.C.; Tan, C.S.
1532015Numerical analyses on optimizing a heat pipe thermal management system for lithium-ion batteries during fast chargingYe, Yonghuang; Saw, Liphuat; Shi, Yixiang; Tay, Ah Ong Andrew 
154May-2006Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packagingLiao, E.B.; Tay, A.A.O. ; Ang, S.S. ; Feng, H.H.; Nagarajan, R.; Kripesh, V.
155Mar-2010Numerical and experimental study of interface delamination in flip chip BGA packageGuojun, H.; Tay, A.A.O. ; Jing-En, L.; Yiyi, M.
156Jul-2011Numerical investigation of transfer coefficients of an evaporatively-cooled condenserJahangeer, K.A. ; Tay, A.A.O. ; Raisul Islam, M.
1572012Numerical modeling of axial junction compositionally graded In xGa1-xN nanorod solar cellsHo, J.-W.; Tay, A.A.O. ; Chua, S.-J. 
1582006Numerical simulation of capillary and fluid dynamic forces on tiny chips in fluidic self-assembly processTay, A.A.O. ; Li, H.; Gao, X. ; Chen, J.; Kripesh, V.
159Dec-2003Numerical simulation of delamination in IC packages using a new variable-order singular boundary elementTay, A.A.O. ; Lee, K.H. ; Lim, K.M. 
1601997Numerical simulation of the flip-chip underfilling processTay, A.A.O. ; Huang, Z.M. ; Wu, J.H. ; Cui, C.Q.