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|Title:||Simulation of three-dimensional wirebond deformation during transfer molding||Authors:||Tay, A.A.O.
|Issue Date:||1995||Citation:||Tay, A.A.O.,Yeo, K.S.,Wu, J.H. (1995). Simulation of three-dimensional wirebond deformation during transfer molding. Proceedings - Electronic Components and Technology Conference : 999-1004. ScholarBank@NUS Repository.||Abstract:||During the transfer molding process, flow induced forces act on the wirebonds causing them to deform. If the deformation is excessive, package failure may arise. This paper describes the computer simulation of three-dimensional wirebond deformation using a boundary integral method. The accuracy of the method was verified by experiment. The method was then applied to a case study involving a 26-leaded IC package.||Source Title:||Proceedings - Electronic Components and Technology Conference||URI:||http://scholarbank.nus.edu.sg/handle/10635/51746||ISSN:||05695503|
|Appears in Collections:||Staff Publications|
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