Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/51746
Title: Simulation of three-dimensional wirebond deformation during transfer molding
Authors: Tay, A.A.O. 
Yeo, K.S. 
Wu, J.H. 
Issue Date: 1995
Source: Tay, A.A.O.,Yeo, K.S.,Wu, J.H. (1995). Simulation of three-dimensional wirebond deformation during transfer molding. Proceedings - Electronic Components and Technology Conference : 999-1004. ScholarBank@NUS Repository.
Abstract: During the transfer molding process, flow induced forces act on the wirebonds causing them to deform. If the deformation is excessive, package failure may arise. This paper describes the computer simulation of three-dimensional wirebond deformation using a boundary integral method. The accuracy of the method was verified by experiment. The method was then applied to a case study involving a 26-leaded IC package.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/51746
ISSN: 05695503
Appears in Collections:Staff Publications

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