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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/51746
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dc.titleSimulation of three-dimensional wirebond deformation during transfer molding
dc.contributor.authorTay, A.A.O.
dc.contributor.authorYeo, K.S.
dc.contributor.authorWu, J.H.
dc.date.accessioned2014-04-25T07:58:24Z
dc.date.available2014-04-25T07:58:24Z
dc.date.issued1995
dc.identifier.citationTay, A.A.O.,Yeo, K.S.,Wu, J.H. (1995). Simulation of three-dimensional wirebond deformation during transfer molding. Proceedings - Electronic Components and Technology Conference : 999-1004. ScholarBank@NUS Repository.
dc.identifier.issn05695503
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/51746
dc.description.abstractDuring the transfer molding process, flow induced forces act on the wirebonds causing them to deform. If the deformation is excessive, package failure may arise. This paper describes the computer simulation of three-dimensional wirebond deformation using a boundary integral method. The accuracy of the method was verified by experiment. The method was then applied to a case study involving a 26-leaded IC package.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL & PRODUCTION ENGINEERING
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.description.sourcetitleProceedings - Electronic Components and Technology Conference
dc.description.page999-1004
dc.description.codenPECCA
dc.identifier.isiutNOT_IN_WOS
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