Full Name
Choi, W.K.
Variants
Choi, W.-K.
Choi Wee Kion
Choi, Wee kiong
Choi, W.K
Choi, W.
Choi Wee Kiong
Choi, W.K.
 
 
Email
elechoi@nus.edu.sg
 

Publications

Refined By:
Date Issued:  [2000 TO 2009]
Author:  Pey, K.L.

Results 1-20 of 28 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
12009Arrayed Si/SiGe nanowire heterostructure formation via Au-catalyzed wet chemical etching methodWang, X.; Pey, K.L.; Choi, W.K. ; Ho, C.K.F.; Fitzgerald, E.; Antoniadis, D.
22009Arrayed sisige nanowire and heterostructure formations via au-assisted wet chemical etching methodWang, X.; Pey, K.L.; Choi, W.K. ; Ho, C.K.F.; Fitzgerald, E.; Antoniadis, D.
331-Dec-2001Effect of current direction on the lifetime of different levels of Cu dual-damascene metallizationGan, C.L.; Thompson, C.V.; Pey, K.L. ; Choi, W.K. ; Tay, H.L.; Yu, B.; Radhakrishnan, M.K.
42003Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect treesGan, C.L.; Thompson, C.V.; Pey, K.L.; Choi, W.K. ; Chang, C.W.; Guo, Q.
51-Aug-2005Effect of Pt on agglomeration and Ge out diffusion in Ni(Pt) germanosilicideJin, L.J.; Pey, K.L.; Choi, W.K. ; Fitzgerald, E.A.; Antoniadis, D.A.; Pitera, A.J.; Lee, M.L.; Chi, D.Z.; Rahman, Md.A.; Osipowicz, T. ; Tung, C.H.
62007Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnectsChang, C.W.; Thompson, C.V.; Gan, C.L.; Pey, K.L.; Choi, W.K. ; Lim, Y.K.
710-May-2006Electrical characterization of platinum and palladium effects in nickel monosilicide/n-Si Schottky contactsJin, L.J.; Pey, K.L.; Choi, W.K. ; Antoniadis, D.A.; Fitzgerald, E.A.; Chi, D.Z.
81-May-2006Electromigration resistance in a short three-contact interconnect treeChang, C.W.; Choi, Z.-S.; Thompson, C.V.; Gan, C.L.; Pey, K.L.; Choi, W.K. ; Hwang, N.
915-Jul-2003Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect treesGan, C.L.; Thompson, C.V.; Pey, K.L.; Choi, W.K. 
102002Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect treesGan, C.L.; Thompson, C.V.; Pey, K.L. ; Choi, W.K. ; Wei, F.; Yu, B.; Hau-Riege, S.P.
112003Experimental characterization of the reliability of multi-terminal dual-damascene copper interconnect treesGan, C.L.; Thompson, C.V.; Pey, K.L.; Choi, W.K. ; Chang, C.W.; Guo, Q.
122007Full range workfunction tunning of MOSFETs using interfacial yttrium layer in fully germanided Ni gateYu, H.P.; Pey, K.L.; Choi, W.K. ; Antoniadis, D.A.; Fitzgerald, E.A.; Dawood, M.K.; Ow, K.Q.; Chi, D.Z.
1315-May-2005Highly oriented Ni(Pd)SiGe formation at 400 °cJin, L.J.; Pey, K.L.; Choi, W.K. ; Fitzgerald, E.A.; Antoniadis, D.A.; Pitera, A.J.; Lee, M.L.; Tung, C.H.
1415-May-2005Highly oriented Ni(Pd)SiGe formation at 400 °cJin, L.J.; Pey, K.L.; Choi, W.K. ; Fitzgerald, E.A.; Antoniadis, D.A.; Pitera, A.J.; Lee, M.L.; Tung, C.H.
151-Jul-2002Interfacial reactions of Ni on Si 1-xGe x (x=0.2,0.3) at low temperature by rapid thermal annealingZhao, H.B.; Pey, K.L. ; Choi, W.K. ; Chattopadhyay, S.; Fitzgerald, E.A.; Antoniadis, D.A.; Lee, P.S.
162002Length effects on the reliability of dual-damascene Cu interconnectsWei, F.; Gan, C.L.; Thompson, C.V.; Clement, J.J.; Hau-Riege, S.P.; Pey, K.L. ; Choi, W.K. ; Tay, H.L.; Yu, B.; Radhakrishnan, M.K.
172004Mortality dependence of Cu dual damascene interconnects on adjacent segmentChang, C.W.; Gan, C.L.; Thompson, C.V.; Pey, K.L.; Choi, W.K. ; Hwang, N.
182005Multi-via electromigration test structures for identification and characterization of different failure mechanismsChoi, Z.-S.; Chang, C.W.; Lee, J.H.; Gan, C.L.; Thompson, C.V.; Pey, K.L.; Choi, W.K. 
19Nov-2001N2O oxidation of strained-Si/relaxed-SiGe heterostructure grown by UHVCVDTan, C.S.; Choi, W.K. ; Bera, L.K. ; Pey, K.L. ; Antoniadis, D.A.; Fitzgerald, E.A.; Currie, M.T.; Maiti, C.K.
2020-Nov-2002Nickel silicidation on polycrystalline silicon germanium filmsChoi, W.K. ; Pey, K.L. ; Zhao, H.B.; Osipowicz, T. ; Shen, Z.X.