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Title: Mortality dependence of Cu dual damascene interconnects on adjacent segment
Authors: Chang, C.W.
Gan, C.L.
Thompson, C.V.
Pey, K.L.
Choi, W.K. 
Hwang, N.
Issue Date: 2004
Citation: Chang, C.W.,Gan, C.L.,Thompson, C.V.,Pey, K.L.,Choi, W.K.,Hwang, N. (2004). Mortality dependence of Cu dual damascene interconnects on adjacent segment. Materials Research Society Symposium Proceedings 812 : 339-344. ScholarBank@NUS Repository.
Abstract: Three terminal 'dotted-I' interconnect structures, with vias at both ends and an additional via in the middle, were tested under a variety of test conditions. Failures (mortalities) were observed even when segments were tested under conditions that would not have led to failure in two-terminal structures. Mortalities were found in right segments with jL values as low as 1250 A/cm, which is lower when compared to the immortality condition (jL) cr of 3700 A/cm reported for similar via-terminated structures. Moreover, we found that the mortality of a dotted-I segment is dependent on the direction and magnitude of the current in the adjacent segment. These results suggest that there is not a definite value of the jL product that defines true immortality in individual segments that are part of an interconnect tree. More importantly, the critical jL value for a single segment of Cu interconnects may be reduced or increased by an adjacent segment. Therefore independently determined (jL) cr values cannot be directly applied to interconnects with branched segments, but rather the magnitude as well as the direction of the current flow in the adjoining segments must be taken into consideration in evaluating the immortality of interconnect segments in an interconnect network.
Source Title: Materials Research Society Symposium Proceedings
ISSN: 02729172
Appears in Collections:Staff Publications

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