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| | Issue Date | Title | Author(s) |
| 21 | 2006 | Modeling adhesive failure in electronic packages | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 22 | 1-Oct-2011 | Modeling hydrogen attack effect on creep fracture toughness | Tang, S. ; Guo, T.F.; Cheng, L. |
| 23 | 1-Aug-2002 | Modeling vapor pressure effects on void rupture and crack growth resistance | Guo, T.F. ; Cheng, L. |
| 24 | 2010 | Numerical and experimental study of fluorescence enhancement with silica encapsulated metallic nanoparticles | Zhang, J.B.; Ho, J.F.; Cheng, L. ; Teo, Q.Q.; Sze, J.Y.; Luk'yanchuk, B. |
| 25 | 2019 | On Bayesian oracle properties | Jiang, W.; Li, C. |
| 26 | 2002 | Popcorn failure and unstable void growth in plastic electronic packages | Chong, C.W.; Guo, T.F. ; Cheng, L. |
| 27 | 15-Aug-2003 | Predicting the failure strains of Al/SiC composites with reacted matrix-reinforcement interfaces | Tham, L.M.; Gupta, M. ; Cheng, L. |
| 28 | Apr-2007 | Pressure-sensitive ductile layers - I. Modeling the growth of extensive damage | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 29 | 1-Aug-2007 | Pressure-sensitive ductile layers - II. 3D models of extensive damage | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 30 | 1999 | Propagation of interface edge cracks by mechanical and thermal strains | Hin Wong, W.; Cheng, L. ; Zhang, Y.-W. |
| 31 | 2007 | Rate dependent interface delamination in plastic IC packages | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 32 | Mar-2008 | Rate effects on toughness in elastic nonlinear viscous solids | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 33 | 21-Nov-2010 | Surface instability maps for soft materials | Wong, W.H.; Guo, T.F.; Zhang, Y.W.; Cheng, L. |
| 34 | 15-Dec-2001 | Thermal and vapor pressure effects on cavitation and void growth | Guo, T.F. ; Cheng, L. |
| 35 | 2009 | Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects | Cheong, W.G.; Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 36 | 1998 | Thin film failure using an interface delamination law | Liu, P.; Cheng, L. ; Zhang, Y.W. |
| 37 | Aug-2005 | Vapor pressure and residual stress effects on failure of an adhesive film | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 38 | Aug-2005 | Vapor pressure and residual stress effects on mixed mode toughness of an adhesive film | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 39 | Nov-2004 | Vapor pressure and residual stress effects on the toughness of polymeric adhesive joints | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 40 | Jun-2003 | Vapor pressure and void size effects on failure of a constrained ductile film | Guo, T.F. ; Cheng, L. |
