Please use this identifier to cite or link to this item:
|Title:||Rate dependent interface delamination in plastic IC packages||Authors:||Tang, S.
|Issue Date:||2007||Citation:||Tang, S., Guo, T.F., Cheng, L. (2007). Rate dependent interface delamination in plastic IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 680-685. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469807||Abstract:||This paper examines the quasi-static steady-state crack growth at the interface joining viscoelastic polymeric material and hard substrates assisted by the internal vapor pressure in IC packages. Void growth and coalescence in the fracture process zone at the interface is modeled by a nonlinear viscous porous strip incorporating vapor pressure effect. The polymeric material surrounding the fracture process zone is taken as the nonlinear viscoelastic solids. To facilitate the understanding of vapor pressure, mode mixity and rate effects on the relationship between interface toughness and crack velocity, two computational models have been employed: (i) elastic background material with viscous fracture process zone (FPZ); (ii) viscoelastic background material with viscous fracture process zone. The present simulations offer some insights into viscoelastic delamination of polymer-substrate interfaces in plastic IC packages. © 2007 IEEE.||Source Title:||Proceedings of the Electronic Packaging Technology Conference, EPTC||URI:||http://scholarbank.nus.edu.sg/handle/10635/73797||ISBN:||1424413249||DOI:||10.1109/EPTC.2007.4469807|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.