Please use this identifier to cite or link to this item:
|Title:||Propagation of interface edge cracks by mechanical and thermal strains||Authors:||Hin Wong, W.
|Issue Date:||1999||Citation:||Hin Wong, W.,Cheng, L.,Zhang, Y.-W. (1999). Propagation of interface edge cracks by mechanical and thermal strains. American Society of Mechanical Engineers, EEP 26 : 2/-. ScholarBank@NUS Repository.||Abstract:||Computer simulations of decohesion along one of the interfaces between a thin ductile metal layer and elastic substrates are carried out by using a finite element method. The layer is taken to be elastic-plastic and the fracture process zone has separation characteristics that follow a traction-separation law. This law is characterized by the peak separation stress σ and work of separation per unit area Γ0. The effects of thermal loading rate, the layer thickness and layer-substrate modulus mismatch on the steady-state interface toughness, plastic zone size and shape are investigated. Our simulation results show that the heating process is more critical than the cooling process. Both thin film thickness and elastic mismatch between the film and substrates have marked effects on the steady-state toughness.||Source Title:||American Society of Mechanical Engineers, EEP||URI:||http://scholarbank.nus.edu.sg/handle/10635/92831|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Oct 12, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.