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| | Issue Date | Title | Author(s) |
| 1 | Oct-2008 | C*-controlled creep crack growth by grain boundary cavitation | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 2 | Nov-2008 | Creep fracture toughness using conventional and cell element approaches | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 3 | 2000 | Dynamic ductile crack growth and transition to cleavage - A cell model approach | Xia, L.; Cheng, L. |
| 4 | Feb-2009 | Dynamic toughness in elastic nonlinear viscous solids | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 5 | 20-Sep-2001 | Effect of limited matrix-reinforcement interfacial reaction on enhancing the mechanical properties of aluminium-silicon carbide composites | Tham, L.M.; Gupta, M. ; Cheng, L. |
| 6 | 31-Mar-2002 | Effect of reinforcement volume fraction on the evolution of reinforcement size during the extrusion of Al-SiC composites | Tham, L.M.; Gupta, M. ; Cheng, L. |
| 7 | Oct-2006 | Effects of pressure-sensitivity and plastic dilatancy on void growth and interaction | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 8 | 2005 | Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method | Sim, C.N.; Tay, C.J. ; Cheng, L. |
| 9 | 1-Aug-2010 | Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysis | Wong, W.H.; Guo, T.F.; Zhang, Y.W. ; Cheng, L. |
| 10 | 2005 | Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 11 | 2008 | Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 12 | Oct-1999 | Influence of processing parameters during disintegrated melt deposition processing on near net shape synthesis of aluminium based metal matrix composites | Tham, L.M.; Gupta, M. ; Cheng, L. |
| 13 | 19-May-1999 | Influence of processing parameters on the near-net shape synthesis of aluminium-based metal matrix composites | Tham, L.M.; Gupta, M. ; Cheng, L. |
| 14 | 2007 | Influence of vapor pressure on rate-dependent void growth in IC packages | Wong, W.H.; Guo, T.F. ; Cheng, L. |
| 15 | Feb-2003 | Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model | Liu, P.; Cheng, L. ; Zhang, Y.-W. |
| 16 | 16-Mar-2001 | Interface toughness under combined mode I, II and III loadings | Liu, P.; Cheng, L. ; Zhang, Y.W. |
| 17 | 14-Mar-2001 | Measuring interface parameters and toughness - A computational study | Liu, P.; Cheng, L. ; Zhang, Y.W. |
| 18 | 2009 | Metallic nanoparticles and nanostructures for bio-applications | Zhang, J.B.; Cheng, L. ; Yung, L.Y.L. ; Chua, S.S.; Sze, J.Y.; Zhu, S.L.; Ayi, T.C.; Jeevaneswaran, R. |
| 19 | 1-Jan-1999 | Micromechanical modeling of processing-induced damage in Al-SiC metal matrix composites synthesized using the disintegrated melt deposition technique | Tham, L.M.; Su, L.; Cheng, L. ; Gupta, M. |
| 20 | 1-May-2008 | Mode mixity and nonlinear viscous effects on toughness of interfaces | Tang, S. ; Guo, T.F. ; Cheng, L. |
