1. ScholarBank@NUS

GUO TIAN-FU

rp06415

Collaboration Map View Statistics Email Alert RSS Feed

Profile

Full Name
GUO TIAN-FU
Variants
Guo, T.F.
Guo, T.
 
Main Affiliation
 
Faculty
 
Email
mseguotf@nus.edu.sg
 

Publications

Results 1-20 of 41 (Search time: 0.066 seconds).

Issue DateTitleAuthor(s)
1Jun-1998A new numerical simulation method of high Reynolds number flow around a cylinderGuo, T. ; Chew, Y.T. ; Luo, S.C. ; Su, M.D.
2Oct-2008C*-controlled creep crack growth by grain boundary cavitationTang, S. ; Guo, T.F. ; Cheng, L. 
3Jun-2008Continuum modeling of a porous solid with pressure-sensitive dilatant matrixGuo, T.F. ; Faleskog, J.; Shih, C.F. 
4Nov-2008Creep fracture toughness using conventional and cell element approachesTang, S. ; Guo, T.F. ; Cheng, L. 
5Feb-2009Dynamic toughness in elastic nonlinear viscous solidsTang, S. ; Guo, T.F. ; Cheng, L. 
6Oct-2006Effects of pressure-sensitivity and plastic dilatancy on void growth and interactionChew, H.B.; Guo, T.F. ; Cheng, L. 
72005Influence of non-uniform initial porosity distribution on adhesive failure in electronic packagesChew, H.B.; Guo, T.F. ; Cheng, L. 
82008Influence of nonuniform initial porosity distribution on adhesive failure in electronic packagesChew, H.B.; Guo, T.F. ; Cheng, L. 
92007Influence of vapor pressure on rate-dependent void growth in IC packagesWong, W.H.; Guo, T.F. ; Cheng, L. 
102007Influence of vapor pressure on rate-dependent void growth in IC packagesWong, W.H.; Guo, T.F. ; Cheng, L. 
111-May-2008Mode mixity and nonlinear viscous effects on toughness of interfacesTang, S. ; Guo, T.F. ; Cheng, L. 
121-May-2008Mode mixity and nonlinear viscous effects on toughness of interfacesTang, S. ; Guo, T.F. ; Cheng, L. 
132006Modeling adhesive failure in electronic packagesChew, H.B.; Guo, T.F. ; Cheng, L. 
142006Modeling adhesive failure in electronic packagesChew, H.B.; Guo, T.F. ; Cheng, L. 
151-Aug-2002Modeling vapor pressure effects on void rupture and crack growth resistanceGuo, T.F. ; Cheng, L. 
162002Popcorn failure and unstable void growth in plastic electronic packagesChong, C.W.; Guo, T.F. ; Cheng, L. 
17Apr-2007Pressure-sensitive ductile layers - I. Modeling the growth of extensive damageChew, H.B.; Guo, T.F. ; Cheng, L. 
18Apr-2007Pressure-sensitive ductile layers - I. Modeling the growth of extensive damageChew, H.B.; Guo, T.F. ; Cheng, L. 
191-Aug-2007Pressure-sensitive ductile layers - II. 3D models of extensive damageChew, H.B.; Guo, T.F. ; Cheng, L. 
201-Aug-2007Pressure-sensitive ductile layers - II. 3D models of extensive damageChew, H.B.; Guo, T.F. ; Cheng, L.