Please use this identifier to cite or link to this item:
Title: Popcorn failure and unstable void growth in plastic electronic packages
Authors: Chong, C.W.
Guo, T.F. 
Cheng, L. 
Keywords: FEA
IC packages
Multiaxial straining
Popcorn failure
Unstable void growth
Issue Date: 2002
Citation: Chong, C.W.,Guo, T.F.,Cheng, L. (2002). Popcorn failure and unstable void growth in plastic electronic packages. Key Engineering Materials 227 : 61-66. ScholarBank@NUS Repository.
Abstract: In order to gain some insights into popcorn failure in plastic electronic packages, the phenomenon of unstable void growth of an incompressible neo-Hookean solid under non-symmetric loading is examined. A representative material cell containing a single microvoid is employed in the numerical analysis, where the effect of moisture can be easily incorporated; this cell is subjected to combined internal vapor pressure and remote thermal stress. Results have revealed that there is a maximum allowable mean stress, referred as the critical stress, which defines the onset of unstable void growth - the precursor of popcorn failure. Locus of the critical mean stress versus internal vapor pressure is obtained for typical values of initial porosity under uniaxial, equi-biaxial and equi-triaxial strainings. Results have clearly shown that the critical stress depreciates significantly as the internal vapor pressure is increased. This critical mean stress may therefore be perceived as a suitable criterion for initiation of popcorn failure in IC packages.
Source Title: Key Engineering Materials
ISSN: 10139826
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

checked on Jun 23, 2022

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.