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|Title:||Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method||Authors:||Sim, C.N.
Residual stress measurement
|Issue Date:||2005||Citation:||Sim, C.N., Tay, C.J., Cheng, L. (2005). Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method. Proceedings of SPIE - The International Society for Optical Engineering 5852 PART II : 938-944. ScholarBank@NUS Repository. https://doi.org/10.1117/12.621936||Abstract:||Residual stresses is measured using a new technique combining hole indentation with Electronic Speckle Pattern Interferometry (ESPI). The technique is superior to conventional methods such as the widely used rosette strain-gage hole drilling technique in the ease of experimental set up and the use of optics in strain measurement allows results to be displayed in real-time. The technique is fast, simple, less destructive and has great potential to be developed into a quality inspection tool in the production/field environment.||Source Title:||Proceedings of SPIE - The International Society for Optical Engineering||URI:||http://scholarbank.nus.edu.sg/handle/10635/73416||ISSN:||0277786X||DOI:||10.1117/12.621936|
|Appears in Collections:||Staff Publications|
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