Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.621936
DC FieldValue
dc.titleElectronic speckle pattern interferometry of residual stress measurement using hole-indentation method
dc.contributor.authorSim, C.N.
dc.contributor.authorTay, C.J.
dc.contributor.authorCheng, L.
dc.date.accessioned2014-06-19T05:34:50Z
dc.date.available2014-06-19T05:34:50Z
dc.date.issued2005
dc.identifier.citationSim, C.N., Tay, C.J., Cheng, L. (2005). Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method. Proceedings of SPIE - The International Society for Optical Engineering 5852 PART II : 938-944. ScholarBank@NUS Repository. https://doi.org/10.1117/12.621936
dc.identifier.issn0277786X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73416
dc.description.abstractResidual stresses is measured using a new technique combining hole indentation with Electronic Speckle Pattern Interferometry (ESPI). The technique is superior to conventional methods such as the widely used rosette strain-gage hole drilling technique in the ease of experimental set up and the use of optics in strain measurement allows results to be displayed in real-time. The technique is fast, simple, less destructive and has great potential to be developed into a quality inspection tool in the production/field environment.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1117/12.621936
dc.sourceScopus
dc.subjectESPI
dc.subjectHole indentation
dc.subjectOut-of-plane displacement
dc.subjectResidual stress measurement
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1117/12.621936
dc.description.sourcetitleProceedings of SPIE - The International Society for Optical Engineering
dc.description.volume5852 PART II
dc.description.page938-944
dc.description.codenPSISD
dc.identifier.isiut000229932000147
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