Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.621936
Title: Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
Authors: Sim, C.N.
Tay, C.J. 
Cheng, L. 
Keywords: ESPI
Hole indentation
Out-of-plane displacement
Residual stress measurement
Issue Date: 2005
Source: Sim, C.N., Tay, C.J., Cheng, L. (2005). Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method. Proceedings of SPIE - The International Society for Optical Engineering 5852 PART II : 938-944. ScholarBank@NUS Repository. https://doi.org/10.1117/12.621936
Abstract: Residual stresses is measured using a new technique combining hole indentation with Electronic Speckle Pattern Interferometry (ESPI). The technique is superior to conventional methods such as the widely used rosette strain-gage hole drilling technique in the ease of experimental set up and the use of optics in strain measurement allows results to be displayed in real-time. The technique is fast, simple, less destructive and has great potential to be developed into a quality inspection tool in the production/field environment.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/73416
ISSN: 0277786X
DOI: 10.1117/12.621936
Appears in Collections:Staff Publications

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