Please use this identifier to cite or link to this item:
|Title:||Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method|
Residual stress measurement
|Source:||Sim, C.N., Tay, C.J., Cheng, L. (2005). Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method. Proceedings of SPIE - The International Society for Optical Engineering 5852 PART II : 938-944. ScholarBank@NUS Repository. https://doi.org/10.1117/12.621936|
|Abstract:||Residual stresses is measured using a new technique combining hole indentation with Electronic Speckle Pattern Interferometry (ESPI). The technique is superior to conventional methods such as the widely used rosette strain-gage hole drilling technique in the ease of experimental set up and the use of optics in strain measurement allows results to be displayed in real-time. The technique is fast, simple, less destructive and has great potential to be developed into a quality inspection tool in the production/field environment.|
|Source Title:||Proceedings of SPIE - The International Society for Optical Engineering|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 22, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.