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|Title:||Thin film failure using an interface delamination law||Authors:||Liu, P.
|Issue Date:||1998||Citation:||Liu, P.,Cheng, L.,Zhang, Y.W. (1998). Thin film failure using an interface delamination law. Proceedings of the Electronic Packaging Technology Conference, EPTC : 43-48. ScholarBank@NUS Repository.||Abstract:||Interfacial debonding of multi-layer thin film systems in microelectronics can severely affect device functionality and reliability. There is great engineering value to quantitatively evaluate the interface adhesion strength so as to control the adhesion quality. It has been known that the formation energy of new crack surfaces along an interface and the plastic dissipation occurring in the bulk materials are the two major energy contributions to the total interface toughness. The total interface toughness is the only quantity measurable in a fracture experiment To understand the adhesion strength of interfaces, one has separate the two energy contributions to the total toughness. This can be achieved by computational modeling of the failure process. In this paper, the fracture process zone model is used to specify the properties of the interface, in which the major parameters are the work of separation and peak strength. This model is readily incorporated into a finite element analysis which can be used to predict interfacial decohesion and crack advance along the interface. There is no need to introduce an additional failure criterion and this is an attractive feature of the above approach. We have analyzed interface crack growth in a 4-point bend specimen. Interfacial crack growth occurs under mixed mode. The crack growth resistance and the contribution of plastic dissipation to the total interface toughness are calculated for crack growth along one of the interfaces of a ductile thin film joined with two elastic substrates. The effects of the thickness of the ductile thin layer, the peak separation strength and work of separation on the total work of fracture and the steady-state work of fracture are discussed.||Source Title:||Proceedings of the Electronic Packaging Technology Conference, EPTC||URI:||http://scholarbank.nus.edu.sg/handle/10635/58830|
|Appears in Collections:||Staff Publications|
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