1. ScholarBank@NUS

Chengkuo Lee

rp00168

Collaboration Map View Statistics Email Alert RSS Feed

Profile

Full Name
Chengkuo Lee
Variants
Lee, C.-K.
Lee Chengkuo
Chengkuo, L.
Lee, C.
Lee, C.K.
Lee Chengkun
Lee Cheng Kuo
Lee, Vincent Ch
Vincent Lee
 
Main Affiliation
 
Faculty
 
Email
elelc@nus.edu.sg
 

Publications

Refined By:
Author:  rp00168
Type:  Conference Paper

Results 81-100 of 100 (Search time: 0.006 seconds).

Issue DateTitleAuthor(s)
81Oct-2012Piezoelectric MEMS-based wideband energy harvesting systems using a frequency-up-conversion cantilever stopperLiu, H.; Lee, C. ; Kobayashi, T.; Tay, C.J. ; Quan, C. 
22015Scalable fabrication of triboelectric nanogenerators for commercial applicationsDhakar, L ; Shan, X; Wang, Z; Yang, B; Eng Hock Tay ; Heng, C.-H ; Lee, C 
32016Self-powered In-plane Accelerometer Using Triboelectric MechanismGupta, R.K; Dhakar, L ; Lee, C 
42018Self-Powered Triboelectric Inertial Sensor Ball for IoT and Wearable ApplicationsShi, Q. ; Wang, H. ; He, T.; Lee, C. 
52010Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applicationsLou, L.; Ramakrishna, K.; Shao, L.; Park, W.-T.; Yu, D.; Lim, L.; Wee, Y.; Kripesh, V.; Feng, H.; Chua, B.S.Y.; Lee, C. ; Kwong, D.-L.
62008Silicon beam structures comprising nanophotonics as NEMS sensorsLee, C. ; Thillaigovindan, J.; Radhakrishnan, R.; Li, J.; Balasubramanian, N.
72008Study of Ag-In solder as low temperature wafer bonding intermediate layerMade, R.I.; Gan, C.L.; Lee, C. ; Yan, L.L.; Yu, A.; Yoon, S.W.; Lau, J.H.
82013Study of the wideband behavior of an in-plane electromagnetic MEMS energy harvesterLiu, H.; Qian, Y.; Wang, N.; Lee, C. 
92016Study of Triboelectric Micromechanism for Three Dimensional Energy HarvestingDhakar, L ; Eng Hock Tay ; Lee, C 
1025-Jan-2021Subwavelength-Engineered Suspended Silicon Waveguide for Long-Wave Infrared Sensing ApplicationsLiu, W ; Ma, Y ; Chang, Y ; Dong, B ; Wei, J ; Ren, Z ; Lee, C 
112008The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bondingYu, D.; Lee, C. ; Lau, J.H.
122008Theoretical study of the output energy for various MEMS based electrostatic mechanismsLim, Y.M.; Yang, B.; Kotlanka, R.K.; Heng, C.H. ; Xie, J.; Tang, M.; Han, J.H.; Feng, H.; Lee, C. 
132013Thermally tunable photonic dual-disk resonator with wide operation rangeLi, B.; Ho, C.P.; Lee, C. 
142010Torsional mirror driven by a cantilever beam integrated with 1x10 individually biased PZT array actuator for VOA applicationKoh, K.H.; Kobayashi, T.; Lee, C. 
152013Tunable THz filter using 3-D split-ring resonatorsLin, Y.-S.; Ho, C.P.; Pitchappa, P.; Ma, F.; Qian, Y.; Kropelnicki, P.; Lee, C. 
162013Ultra-broadband electromagnetic MEMS vibration energy harvestingLiu, H.; Dhakar, L.; Lee, C. 
172010Ultrasensitive nanowire pressure sensor makes its debutSoon, B.W.; Neuzil, P.; Wong, C.C.; Reboud, J.; Feng, H.H.; Lee, C. 
182012Vacuum based wafer level encapsulation (WLE) of MEMS using physical vapor deposition (PVD)Soon, B.W.; Singh, N.; Tsai, J.M.; Lee, C. 
192008Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallizationYu, D.; Yan, L.; Lee, C. ; Choi, W.K.; Thew, M.L.; Foo, C.K.; Lau, J.H.
202010Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generatorsXie, J.; Lee, C. ; Wang, M.-F.; Feng, H.