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En-Tang Kang

rp07004

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Full Name
En-Tang Kang
Variants
Kang, E.-T.
KANG, EN-TANG
Kang, E.T.
Kong, E.T.
KANG, EN TANG
Kang, En Tang
Kang, E.N.-T.
Kong, E.-T.
Kang, E.
TANG, KANG EN
Kang En Tang
Kang E.-T.
 
Main Affiliation
 
Faculty
 
Email
cheket@nus.edu.sg
 

Publications

Results 161-180 of 745 (Search time: 0.009 seconds).

Issue DateTitleAuthor(s)
16130-May-2000Electroless deposition of copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization and silanizationWu, S.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. 
162Nov-2002Electroless deposition of nickel on fluoropolymers modified by surface graft copolymerizationYang, G.H.; Lim, C.; Tan, Y.P.; Zhang, Y. ; Kang, E.T. ; Neoh, K.G. 
163Aug-2003Electroless metallization of dielectric SiLK surfaces functionalized by viologenYu, W.H.; Zhang, Y. ; Kang, E.T. ; Neoh, K.G. ; Wu, S.Y.; Chow, Y.F.
16413-Nov-2001Electroless metallization of glass surfaces functionalized by silanization and graft polymerization of anilineChen, Y.; Kang, E.T. ; Neoh, K.G. ; Huang, W. 
1652001Electroless Plating of Copper and Nickel on Surface-Modified Poly(tetrafluoroethylene) FilmsZhang, M.C.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. 
166Sep-2001Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-VinylimidazoleZhang, Y. ; Tan, K.L. ; Yang, G.H.; Kang, E.T. ; Neoh, K.G. 
167Nov-2002Electroless plating of copper on (100)-oriented single crystal silicon substrates modified by plasma graft polymerization of 4-vinylpyridineYu, W.H.; Kang, E.T. ; Neoh, K.G. 
16820-Feb-2003Electroless plating of copper on fluorinated polyimide films modified by plasma graft copolymerization and UV-induced graft copolymerization with 4-vinylpyridineWang, W.C.; Vora, R.K.H. ; Kang, E.T. ; Neoh, K.G. 
169Feb-2004Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-VinylpyridineWang, W.C.; Vora, R.H. ; Kang, E.T. ; Neoh, K.G. 
170Sep-2001Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with anilineMa, Z.H.; Tan, K.L. ; Alian, A.D.; Kang, E.T. ; Neoh, K.G. 
171Jan-2002Electroless plating of copper on poly(tetrafluoroethylene) films modified by surface graft copolymerization and quaternizationYu, Z.J.; Kang, E.T. ; Neoh, K.G. 
17230-Oct-2002Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridineWang, W.C.; Kang, E.T. ; Neoh, K.G. 
17323-May-2002Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymersYu, Z.J.; Kang, E.T. ; Neoh, K.G. 
17415-Sep-2008Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridineLi, L.; Yan, G.; Wu, J.; Yu, X.; Guo, Q.; Kang, E. 
175Oct-2002Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazoleYu, W.H.; Zhang, Y. ; Kang, E.T. ; Neoh, K.G. ; Wu, S.Y.; Chow, Y.F.
17614-Jul-2000Electroless plating of palladium and copper on polyaniline filmsMa, Z.H.; Tan, K.L. ; Kang, E.T. 
17722-Aug-2001Electroless plating of palladium and copper on polypyrrole filmsLim, V.W.L.; Kang, E.T. ; Neoh, K.G. 
17815-Jan-2002Electroless polymerization of aniline on platinum and palladium surfacesChen, Y.; Kang, E.T. ; Neoh, K.G. 
1791-Mar-1995Electroless recovery of precious metals from acid solutions by N-containing electroactive polymersKang, E.T. ; Ting, Y.P. ; Neoh, K.G. ; Tan, K.L. 
1801-Jan-1994Electroless reduction and precipitation of gold from acid solution by polypyrroleKang, E.T. ; Ting, Y.P. ; Tan, K.L.