Full Name
LIU LIE
Variants
Liu, L.
 
Main Affiliation
 
 
Email
tslll@nus.edu.sg
 

Publications

Results 1-20 of 33 (Search time: 0.003 seconds).

Issue DateTitleAuthor(s)
12011Accurate analytical anisotropic model of artificial surfaces comprising conducting strip arraysHuang, R. ; Liu, L. ; Kong, L.B. 
22009Analysis and design of an ultra-thin metamaterial absorberHuang, R.F. ; Li, Z.W. ; Kong, L.B. ; Liu, L. ; Matitsine, S. 
32011Bandwidth extension of metamaterials with low reflectivityHuang, R. ; Li, Z.-W. ; Liu, L. ; Kong, L.B. 
41999Characterization of coplanar waveguides on MCM-D silicon substrateLiu, L. ; Lin, F. ; Kooi, P.S. ; Leong, M.S. 
5Nov-2011Characterization of single- and multiwalled carbon nanotube composites for electromagnetic shielding and tunable applicationsLiu, L. ; Kong, L.B. ; Yin, W.-Y.; Matitsine, S. 
6Oct-2005Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packagingLiu, L. ; Yi, S.; Ong, L.S.; Chian, K.S.; Osiyemi, S.; Lim, S.H.; Su, F.
77-Dec-2007Cluster effect in frequency selective composites with randomly distributed long conductive fibresLiu, L. ; Matitsine, S. ; Gan, Y.B. ; Rozanov, K.N.
84-Jul-2005Comment on "high microwave permittivity of multiwalled carbon nanotube composites" [Appl. Phys. Lett. 84, 4956 (2004)]Matitsine, S.M. ; Liu, L. ; Chen, L.F. ; Gan, Y.B. ; Ong, C.K. 
91999Construct GaAs FET dc model from drain-port dc power and conductanceLiu, L. ; Lin, F. ; Kooi, P.S. ; Leong, M.S. 
102004Cure of underfills in flip chips using microwaveYi, S.; Liu, L. ; Park, S.K.
1115-Sep-2005Effective permittivity of planar composites with randomly or periodically distributed conducting fibersLiu, L. ; Matitsine, S.M. ; Gan, Y.B. ; Rozanov, K.N.
122008Electromagnetic smart screen for tunable transmission and reflection applicationsLiu, L. ; Matitsine, S.; Tan, P.K.
13Jun-2008Electromagnetic smart screen for tunable transmission applicationsLiu, L. ; Matitsine, S. ; Tan, P.K.
14Apr-2011Electromagnetic smart screen with extended absorption band at microwave frequencyLiu, L. ; Matitsine, S. ; Huang, R.F. ; Tang, C.B.
152012EMI shielding evaluations of carbon nanotube based coatings and applicationsLi, P.; Shan, Y.; Liu, L. ; Deng, J.; Ong Guat Choon; Yin, X.
16Sep-2012Enhanced microwave magnetic and attenuation properties of composites with free-standing spinel ferrite thick films as fillersYang, Z.H. ; Li, Z.W. ; Liu, L. ; Kong, L.B. 
17Nov-2007Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid techniqueSu, F.; Liu, L. ; Wang, T.
182005FEM analysis of frequency selective composites with regularly or randomly distributed conductive fibersLiu, L. ; Matitsine, S.M. ; Gan, Y.B. ; Rozanow, K.N.
19Sep-2004Finite element analysis for microwave cure of underfill in flip chip packagingLiu, L. ; Yi, S.; Ong, L.S.; Chian, K.S.
202007Frequency dependence of effective permittivity of carbon nanotube compositesLiu, L. ; Matitsine, S. ; Gan, Y.B. ; Chen, L.F. ; Kong, L.B. ; Rozanov, K.N.