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Chengkuo Lee

rp00168

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Full Name
Chengkuo Lee
Variants
Lee, C.-K.
Lee Chengkuo
Chengkuo, L.
Lee, C.
Lee, C.K.
Lee Chengkun
Lee Cheng Kuo
Lee, Vincent Ch
Vincent Lee
 
Main Affiliation
 
Faculty
 
Email
elelc@nus.edu.sg
 

Publications

Refined By:
Author:  Lee, C.
Type:  Conference Paper
Date Issued:  [2007 TO 2009]

Results 1-20 of 34 (Search time: 0.003 seconds).

Issue DateTitleAuthor(s)
1Sep-2009A 1-V operated MEMS variable optical attenuator using piezoelectric PZT thin-film actuatorsLee, C. ; Hsiao, F.-L. ; Kobayashi, T.; Koh, K.H.; Ramana, P.V.; Xiang, W. ; Yang, B.; Tan, C.W.; Pinjala, D.
2Sep-2009A 2-D MEMS Scanning Mirror Using Piezoelectric PZT Beam ActuatorsKoh, K.H.; Kobayashi, T.; Hsiao, F.-L. ; Lee, C. 
32008A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu jointYan, L.; Lee, C. ; Yu, D.; Choi, W.K.; Yu, A.; Yoon, S.U.; Lau, J.H.
4Jan-2009A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with CuYan, L.-L.; Lee, C.-K. ; Yu, D.-Q.; Yu, A.-B.; Choi, W.-K.; Lau, J.-H.; Yoon, S.-U.
52009A nano-ring resonator based on 2-D hexagonal-lattice photonic crystalsHsiao, F.-L. ; Lee, C. 
62009A wideband electromagnetic energy harvester for random vibration sourcesYang, B.; Lee, C. 
72008Analysis of racetrack resonators in surface sensing applicationKargar, A.; Lee, C. 
82007Assembly of single cells array using image dielectrophoresisLu, Y.S.; Liang, Y.L.; Huang, Y.P.; Huang, J.Y.; Lee, C. ; Yen, J.A.
92008Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packagingLee, C. ; Yu, D.; Yu, A.; Yan, L.; Wang, H.; Lau, J.H.
102009Computational study of an optical NEMS sensorLee, C. ; Xiang, W. ; Hsiao, F.-L. 
112007Design and modeling of nanomechanical sensors using silicon 2-D photonic crystalsLee, C. ; Thillaigovindan, J.; Radhakrishnan, R.
122008Design and modeling of nanophotonic beam structures as optical NEMS sensorsLee, C. ; Thillaigovindan, J.; Yu, A.; Radhakrishnan, R.; Chen, C.-C.; Chao, Y.-T.; Lau, J.H.
732008Design and modeling of vacuum packaged MEMS thermoelectric power generator using heat dissipation pathXie, J.; Lee, C. 
742009Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation pathLee, C. ; Xie, J.
752008Design of nanobiophotonics resonators for biomolecules detectionLee, C. ; Yee, A.S.P.; Perera, J.L.J.; Chen, C.-C.; Balasubramanian, N.
762008Development of low temperature bonding using in-based soldersChoi, W.K.; Yu, D.; Lee, C. ; Yan, L.; Yu, A.; Yoon, S.W.; Lau, J.H.; Cho, M.G.; Jo, Y.H.; Lee, H.M.
772009Development of microfluidic device and system for breast cancer cell fluorescence detectionHe, J.H.; Reboud, J.; Ji, H.M.; Lee, C. ; Long, Y.
782009Development of vacuum packaged CMOS thermoelectric energy harvesterLee, C. ; Xie, J.
792008Effect of bonding pressure on the bond strengths of low temperature Ag-In bondsMade, R.I.; Gan, C.L.; Lee, C. ; Yan, L.; Yu, A.; Yoon, S.W.
802009Graphene nanoribbon schottky diodes using asymmetric contactsKargar, A.; Lee, C.