CHEMICAL AND BIOMOLECULAR ENGINEERING

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	Issue Date	Title	Author(s)
2221	18-Jun-2012	Electrostatic characteristics in a large-scale triple-bed circulating fluidized bed system for coal gasification	Cheng, Y. ; Lim, E.W.C. ; Wang, C.-H. ; Guan, G.; Fushimi, C.; Ishizuka, M.; Tsutsumi, A.
2222	2018	Electrospun nanofiber templated assembly of hybrid nanoparticles	Liu, Z. ; Yan, Z.; Bai, L.
2223	Aug-2006	Electrospun micro- and nanofibers for sustained delivery of paclitaxel to treat C6 glioma in vitro	Xie, J. ; Wang, C.-H.
2224	15-Aug-2007	Electrospray in the dripping mode for cell microencapsulation	Xie, J. ; Wang, C.-H.
2225	Aug-2010	Electrophoretic mobility of a spherical liposome	Chen, S.B.
2226	1-Nov-2008	Electrophoresis in protein crystal: Nonequilibrium molecular dynamics simulations	Hu, Z.; Jiang, J.
2227	Jul-1988	Electron spin resonance studies of some chemically synthesized polypyrrole complexes	Kang, E.T. ; Neoh, K.G. ; Matsuyama, T.; Yamaoka, H.
2228	10-Mar-2006	Electron spin resonance microscopy applied to the study of controlled drug release	Blank, A.; Freed, J.H.; Kumar, N.P. ; Wang, C.-H.
2229	1-Jan-1994	Electroless reduction and precipitation of gold from acid solution by polypyrrole	Kang, E.T. ; Ting, Y.P. ; Tan, K.L.
2230	1-Mar-1995	Electroless recovery of precious metals from acid solutions by N-containing electroactive polymers	Kang, E.T. ; Ting, Y.P. ; Neoh, K.G. ; Tan, K.L.
2231	15-Jan-2002	Electroless polymerization of aniline on platinum and palladium surfaces	Chen, Y.; Kang, E.T. ; Neoh, K.G.
2232	22-Aug-2001	Electroless plating of palladium and copper on polypyrrole films	Lim, V.W.L.; Kang, E.T. ; Neoh, K.G.
2233	14-Jul-2000	Electroless plating of palladium and copper on polyaniline films	Ma, Z.H.; Tan, K.L. ; Kang, E.T.
2234	Oct-2002	Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole	Yu, W.H.; Zhang, Y. ; Kang, E.T. ; Neoh, K.G. ; Wu, S.Y.; Chow, Y.F.
2235	15-Sep-2008	Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine	Li, L.; Yan, G.; Wu, J.; Yu, X.; Guo, Q.; Kang, E.
2236	23-May-2002	Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers	Yu, Z.J.; Kang, E.T. ; Neoh, K.G.
2237	30-Oct-2002	Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine	Wang, W.C.; Kang, E.T. ; Neoh, K.G.
2238	Jan-2002	Electroless plating of copper on poly(tetrafluoroethylene) films modified by surface graft copolymerization and quaternization	Yu, Z.J.; Kang, E.T. ; Neoh, K.G.
2239	Sep-2001	Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with aniline	Ma, Z.H.; Tan, K.L. ; Alian, A.D.; Kang, E.T. ; Neoh, K.G.
2240	Feb-2004	Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine	Wang, W.C.; Vora, R.H. ; Kang, E.T. ; Neoh, K.G.