Please use this identifier to cite or link to this item: https://doi.org/10.1016/S0921-5107(01)00545-1
Title: Optical and electrical properties of p-type transparent conducting Cu-Al-O thin films prepared by plasma enhanced chemical vapor deposition
Authors: Wang, Y. 
Gong, H. 
Zhu, F.
Liu, L. 
Huang, L. 
Huan, A.C.H.
Keywords: Cu-Al-O
P-type
PE-MOCVD
Semiconducting
Transparent
Issue Date: 22-Aug-2001
Citation: Wang, Y., Gong, H., Zhu, F., Liu, L., Huang, L., Huan, A.C.H. (2001-08-22). Optical and electrical properties of p-type transparent conducting Cu-Al-O thin films prepared by plasma enhanced chemical vapor deposition. Materials Science and Engineering B: Solid-State Materials for Advanced Technology 85 (2-3) : 131-134. ScholarBank@NUS Repository. https://doi.org/10.1016/S0921-5107(01)00545-1
Abstract: The growth of p-type transparent conducting oxide thin film has attracted much attention due to its potential in making novel transparent p-n junctions for device applications. In this work, the transparent conducting Cu-Al-O thin films were prepared by plasma enhanced chemical vapor deposition using metal organic precursors of Cu(acac)2 and Al(acac)3 (acac=acetylacetonate) in a mole ratio of 1:1 sublimated at 150°C. The metal organic vapor was carried into a reaction chamber by argon gas. Reactive oxygen gas was introduced into the chamber via another gas inlet. Substrate temperatures were varied over the range 630-800°C and the processing pressure was kept constant at about 0.15 Torr. Seebeck effect measurements revealed that these films were p-type semiconductors. X-ray diffraction results showed that Cu-Al-O films were amorphous. The resistivity mechanism of the low resistivity of Cu-Al-O films is probably governed by the scattering of the dominant hole-carriers by impurities. The film conductivity increased with increasing growth temperature. The films prepared at 800°C with a resistivity of 5.0 Ω·cm and transparency of over 60% in the visible light region were achieved. © 2001 Elsevier Science B.V. All rights reserved.
Source Title: Materials Science and Engineering B: Solid-State Materials for Advanced Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/82827
ISSN: 09215107
DOI: 10.1016/S0921-5107(01)00545-1
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