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|Title:||Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy||Authors:||Tiedemann, A.-K.
|Issue Date:||2009||Citation:||Tiedemann, A.-K.,Fakhri, M.,Heiderhoff, R.,Phang, J.C.H.,Balk, L.J. (2009). Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : 515-519. ScholarBank@NUS Repository. https://doi.org/10.1109/IPFA.2009.5232596||Abstract:||Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions. ©2009 IEEE.||Source Title:||Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA||URI:||http://scholarbank.nus.edu.sg/handle/10635/69239||ISBN:||9781424439102||DOI:||10.1109/IPFA.2009.5232596|
|Appears in Collections:||Staff Publications|
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