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https://doi.org/10.1109/IPFA.2009.5232596
| Title: | Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy | Authors: | Tiedemann, A.-K. Fakhri, M. Heiderhoff, R. Phang, J.C.H. Balk, L.J. |
Issue Date: | 2009 | Citation: | Tiedemann, A.-K.,Fakhri, M.,Heiderhoff, R.,Phang, J.C.H.,Balk, L.J. (2009). Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : 515-519. ScholarBank@NUS Repository. https://doi.org/10.1109/IPFA.2009.5232596 | Abstract: | Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions. ©2009 IEEE. | Source Title: | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA | URI: | http://scholarbank.nus.edu.sg/handle/10635/69239 | ISBN: | 9781424439102 | DOI: | 10.1109/IPFA.2009.5232596 |
| Appears in Collections: | Staff Publications |
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