Please use this identifier to cite or link to this item: https://doi.org/10.1109/IPFA.2009.5232596
DC FieldValue
dc.titleAdvanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy
dc.contributor.authorTiedemann, A.-K.
dc.contributor.authorFakhri, M.
dc.contributor.authorHeiderhoff, R.
dc.contributor.authorPhang, J.C.H.
dc.contributor.authorBalk, L.J.
dc.date.accessioned2014-06-19T02:58:24Z
dc.date.available2014-06-19T02:58:24Z
dc.date.issued2009
dc.identifier.citationTiedemann, A.-K.,Fakhri, M.,Heiderhoff, R.,Phang, J.C.H.,Balk, L.J. (2009). Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : 515-519. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IPFA.2009.5232596" target="_blank">https://doi.org/10.1109/IPFA.2009.5232596</a>
dc.identifier.isbn9781424439102
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/69239
dc.description.abstractVertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions. ©2009 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/IPFA.2009.5232596
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/IPFA.2009.5232596
dc.description.sourcetitleProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
dc.description.page515-519
dc.identifier.isiutNOT_IN_WOS
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