Please use this identifier to cite or link to this item: https://doi.org/10.1109/IPFA.2009.5232596
Title: Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy
Authors: Tiedemann, A.-K.
Fakhri, M.
Heiderhoff, R.
Phang, J.C.H. 
Balk, L.J.
Issue Date: 2009
Source: Tiedemann, A.-K.,Fakhri, M.,Heiderhoff, R.,Phang, J.C.H.,Balk, L.J. (2009). Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : 515-519. ScholarBank@NUS Repository. https://doi.org/10.1109/IPFA.2009.5232596
Abstract: Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions. ©2009 IEEE.
Source Title: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
URI: http://scholarbank.nus.edu.sg/handle/10635/69239
ISBN: 9781424439102
DOI: 10.1109/IPFA.2009.5232596
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

4
checked on Dec 13, 2017

Page view(s)

44
checked on Dec 9, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.