Please use this identifier to cite or link to this item:
|Title:||Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy|
|Citation:||Tiedemann, A.-K.,Fakhri, M.,Heiderhoff, R.,Phang, J.C.H.,Balk, L.J. (2009). Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : 515-519. ScholarBank@NUS Repository. https://doi.org/10.1109/IPFA.2009.5232596|
|Abstract:||Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions. ©2009 IEEE.|
|Source Title:||Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Nov 7, 2018
checked on Oct 27, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.