Hole transport through proton-irradiated p -type silicon wafers during electrochemical anodization

Abstract

The hole current density flowing through and around proton-irradiated areas of p -type silicon during electrochemical anodization is simulated and studied experimentally using scanning electron microscopy and photoluminescence imaging. It is shown that for certain irradiation geometries the current flow may be either reduced or enhanced in areas adjacent to irradiated lines, resulting in enhanced or reduced rates of porous silicon formation and corresponding changes in photoluminescence intensity and feature height. The current flow to the surface is unaffected by both the beam straggle and the high defect density at the end of ion range, enabling feature dimensions of ∼200 nm to be attained. This study has enabled fabrication of micromachined and patterned porous silicon structures in anodized wafers with accurate control of feature dimensions, layer thickness, and photoluminescence emission wavelength and intensity. © 2006 The American Physical Society.