Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCPMT.2019.2926792
Title: Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model
Authors: GAO SIPING 
Francesco de Paulis
LIU ENXIAO 
GUO YONGXIN 
Issue Date: 4-Jul-2019
Publisher: IEEE
Citation: GAO SIPING, Francesco de Paulis, LIU ENXIAO, GUO YONGXIN (2019-07-04). Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model. IEEE Transactions on Components, Packaging and Manufacturing Technology. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2019.2926792
Rights: CC0 1.0 Universal
Source Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
URI: https://scholarbank.nus.edu.sg/handle/10635/183394
ISSN: 21563950
DOI: 10.1109/TCPMT.2019.2926792
Rights: CC0 1.0 Universal
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