Please use this identifier to cite or link to this item:
https://doi.org/10.1109/TCPMT.2019.2926792
| Title: | Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model | Authors: | GAO SIPING Francesco de Paulis LIU ENXIAO GUO YONGXIN |
Issue Date: | 4-Jul-2019 | Publisher: | IEEE | Citation: | GAO SIPING, Francesco de Paulis, LIU ENXIAO, GUO YONGXIN (2019-07-04). Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model. IEEE Transactions on Components, Packaging and Manufacturing Technology. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2019.2926792 | Rights: | CC0 1.0 Universal | Source Title: | IEEE Transactions on Components, Packaging and Manufacturing Technology | URI: | https://scholarbank.nus.edu.sg/handle/10635/183394 | ISSN: | 21563950 | DOI: | 10.1109/TCPMT.2019.2926792 | Rights: | CC0 1.0 Universal |
| Appears in Collections: | Staff Publications Elements |
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