Please use this identifier to cite or link to this item:
https://doi.org/10.1109/TCPMT.2019.2926792
| DC Field | Value | |
|---|---|---|
| dc.title | Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model | |
| dc.contributor.author | GAO SIPING | |
| dc.contributor.author | Francesco de Paulis | |
| dc.contributor.author | LIU ENXIAO | |
| dc.contributor.author | GUO YONGXIN | |
| dc.date.accessioned | 2020-11-12T01:31:59Z | |
| dc.date.available | 2020-11-12T01:31:59Z | |
| dc.date.issued | 2019-07-04 | |
| dc.identifier.citation | GAO SIPING, Francesco de Paulis, LIU ENXIAO, GUO YONGXIN (2019-07-04). Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model. IEEE Transactions on Components, Packaging and Manufacturing Technology. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2019.2926792 | |
| dc.identifier.issn | 21563950 | |
| dc.identifier.uri | https://scholarbank.nus.edu.sg/handle/10635/183394 | |
| dc.publisher | IEEE | |
| dc.rights | CC0 1.0 Universal | |
| dc.rights.uri | http://creativecommons.org/publicdomain/zero/1.0/ | |
| dc.type | Article | |
| dc.contributor.department | ELECTRICAL AND COMPUTER ENGINEERING | |
| dc.description.doi | 10.1109/TCPMT.2019.2926792 | |
| dc.description.sourcetitle | IEEE Transactions on Components, Packaging and Manufacturing Technology | |
| dc.published.state | Published | |
| dc.grant.id | National Research Foundation Singapore (NRF) (NRF-CRP17-2017-08) | |
| dc.grant.fundingagency | National Research Foundation, Singapore | |
| Appears in Collections: | Staff Publications Elements | |
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|---|---|---|---|---|---|---|
| RG_copy.pdf | 952.63 kB | Adobe PDF | OPEN | Post-print | View/Download |
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