1. ScholarBank@NUS

Beng Chye, Vincent Tan

rp08133

Collaboration Map View Statistics Email Alert RSS Feed

Profile

Full Name
Beng Chye, Vincent Tan
Variants
Tan, V.B.C.
Tan, V.
Tan V.b.c.
Vincent, T.
Beng Chye Tan, V.
Vincent, T.B.C.
Tan V.B.C.
Beng Chye, Vincent Tan
 
Main Affiliation
 
Faculty
 
Email
mpetanbc@nus.edu.sg
 

Publications

Refined By:
Type:  Conference Paper
Date Issued:  [2000 TO 2009]

Results 1-20 of 21 (Search time: 0.011 seconds).

Issue DateTitleAuthor(s)
12007Ab initio simulations of low-k and ultra low-k dielectric interconnectsTan, V.B.C. ; Dai, L. ; Yang, S.W.; Chen, X.T.; Wu, P.
22005Coarse-grained molecular modeling of composite interfacesTan, V.B.C. ; Deng, M. ; Tay, T.E. 
32007Computational progressive failure of composite structuresTay, T.E. ; Shen, F. ; Liu, G. ; Chua, H.E.; Tan, V.B.C. 
42007Coupling molecular dynamics with amorphous cells for polymer modelingTan, V.B.C. ; Zeng, X.S. ; Yew, Y.K. ; Lim, K.M. ; Tay, T.E. 
52004Dynamic materials testing and modeling of solder interconnectsOng, K.C.; Tan, V.B.C. ; Lim, C.T. ; Wong, E.H.; Zhang, X.W.
62007Dynamic testing of solder joint strength under compression, tension and shearingLiu, J.F. ; Shim, V.P.W. ; Tan, V.B.C. ; Lee, T.K.
72007Failure analysis of open-hole tension (OHT), open-hole compression (OHC), and pin-loaded (PL) composite laminatesTay, T.E. ; Liu, G. ; Shen, F. ; Tan, V.B.C. ; Chua, H.E.
8Feb-2009Glass transition temperature influence on crosslinked and entangled polymer interfacesDeng, M. ; Tan, V.B.C. ; Tay, T.E. ; Lim, K.M. 
92005Investigating the cyclic bending of PCB subassembly during board level drop testPek, E.; Lim, C.T. ; Tee, T.Y.; Luan, J.-E.; Tan, V.B.C. 
102005Investigation of copper and tantalum atoms diffusion in polymers by ab initio molecular dynamicsDai, L. ; Yang, S.-W.; Chen, X.-T.; Wu, P.; Tan, V.B.C. 
112006Joint failure prediction of BGAs via failure force mappingTan, L.B.; Tan, V.B.C. ; Zhang, X.; Lim, C.T. 
122006Micromechanical characterization parameters for a new failure criterion for composite structuresYudhanto, A.; Tay, T.E. ; Tan, V.B.C. 
132005Modal and impact analysis of modern portable electronic productsTan, L.B.; Ang, C.W.; Lim, C.T. ; Tan, V.B.C. ; Zhang, X.
142009Molecular Dynamics Simulation of glass/epoxy interfacesTan, V.B.C. ; Deng, M. ; Tay, T.E. 
152009Multiscale modeling of amorphous materials with adaptivityTan, V.B.C. ; Deng, M. ; Tay, T.E. ; Lim, K.M. 
16Feb-2009Multiscale modeling of Polymers-Bridging the molecular continuum divideTan, V.B.C. ; Deng, M. ; Lim, K.M. ; Tay, T.E. 
172005Nanoindentation study of polymer based nanocompositesNai, M.H.; Lim, C.T. ; Zeng, K.Y.; Tan, V.B.C. 
182009Progressive failure of notched and repaired compositesTay, T.E. ; Ridha, M. ; Liu, G. ; Tan V.b.c. 
192009Rate-dependent properties of Sn-Ag-Cu based lead free solder jointsSu, Y.; Tan, L.B.; Tan, V.B.C. ; Tee, T.Y.
202003Study of microvia failure under PCB flexing loadsSeah, S.K.W. ; Lim, C.T. ; Tan, V.B.C. ; Quah, S.E.