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https://scholarbank.nus.edu.sg/handle/10635/73882
| Title: | Study of microvia failure under PCB flexing loads | Authors: | Seah, S.K.W. Lim, C.T. Tan, V.B.C. Quah, S.E. |
Issue Date: | 2003 | Citation: | Seah, S.K.W.,Lim, C.T.,Tan, V.B.C.,Quah, S.E. (2003). Study of microvia failure under PCB flexing loads. Proceedings - Electronic Components and Technology Conference : 95-99. ScholarBank@NUS Repository. | Abstract: | This paper presents a study on microvia failure caused by mechanical flexing of a printed circuit board (PCB) assembly. Cross sectioning is performed to determine the failure modes and failure locations. For the samples tested, failure is found to occur as a result of delamination of the microvia joints from the PCB core. An analysis of the load-deflection curves together with finite element (FE) modeling is used to further understand this type of microvia failure. For different bending conditions, there is a common trend of failure at the joint level. | Source Title: | Proceedings - Electronic Components and Technology Conference | URI: | http://scholarbank.nus.edu.sg/handle/10635/73882 | ISSN: | 05695503 |
| Appears in Collections: | Staff Publications |
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