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Title: Study of microvia failure under PCB flexing loads
Authors: Seah, S.K.W. 
Lim, C.T. 
Tan, V.B.C. 
Quah, S.E.
Issue Date: 2003
Citation: Seah, S.K.W.,Lim, C.T.,Tan, V.B.C.,Quah, S.E. (2003). Study of microvia failure under PCB flexing loads. Proceedings - Electronic Components and Technology Conference : 95-99. ScholarBank@NUS Repository.
Abstract: This paper presents a study on microvia failure caused by mechanical flexing of a printed circuit board (PCB) assembly. Cross sectioning is performed to determine the failure modes and failure locations. For the samples tested, failure is found to occur as a result of delamination of the microvia joints from the PCB core. An analysis of the load-deflection curves together with finite element (FE) modeling is used to further understand this type of microvia failure. For different bending conditions, there is a common trend of failure at the joint level.
Source Title: Proceedings - Electronic Components and Technology Conference
ISSN: 05695503
Appears in Collections:Staff Publications

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