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dc.titleStudy of microvia failure under PCB flexing loads
dc.contributor.authorSeah, S.K.W.
dc.contributor.authorLim, C.T.
dc.contributor.authorTan, V.B.C.
dc.contributor.authorQuah, S.E.
dc.identifier.citationSeah, S.K.W.,Lim, C.T.,Tan, V.B.C.,Quah, S.E. (2003). Study of microvia failure under PCB flexing loads. Proceedings - Electronic Components and Technology Conference : 95-99. ScholarBank@NUS Repository.
dc.description.abstractThis paper presents a study on microvia failure caused by mechanical flexing of a printed circuit board (PCB) assembly. Cross sectioning is performed to determine the failure modes and failure locations. For the samples tested, failure is found to occur as a result of delamination of the microvia joints from the PCB core. An analysis of the load-deflection curves together with finite element (FE) modeling is used to further understand this type of microvia failure. For different bending conditions, there is a common trend of failure at the joint level.
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleProceedings - Electronic Components and Technology Conference
Appears in Collections:Staff Publications

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