Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/73882
DC FieldValue
dc.titleStudy of microvia failure under PCB flexing loads
dc.contributor.authorSeah, S.K.W.
dc.contributor.authorLim, C.T.
dc.contributor.authorTan, V.B.C.
dc.contributor.authorQuah, S.E.
dc.date.accessioned2014-06-19T05:40:29Z
dc.date.available2014-06-19T05:40:29Z
dc.date.issued2003
dc.identifier.citationSeah, S.K.W.,Lim, C.T.,Tan, V.B.C.,Quah, S.E. (2003). Study of microvia failure under PCB flexing loads. Proceedings - Electronic Components and Technology Conference : 95-99. ScholarBank@NUS Repository.
dc.identifier.issn05695503
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73882
dc.description.abstractThis paper presents a study on microvia failure caused by mechanical flexing of a printed circuit board (PCB) assembly. Cross sectioning is performed to determine the failure modes and failure locations. For the samples tested, failure is found to occur as a result of delamination of the microvia joints from the PCB core. An analysis of the load-deflection curves together with finite element (FE) modeling is used to further understand this type of microvia failure. For different bending conditions, there is a common trend of failure at the joint level.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleProceedings - Electronic Components and Technology Conference
dc.description.page95-99
dc.description.codenPECCA
dc.identifier.isiutNOT_IN_WOS
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