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|Title:||Dynamic testing of solder joint strength under compression, tension and shearing||Authors:||Liu, J.F.
|Issue Date:||2007||Citation:||Liu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K. (2007). Dynamic testing of solder joint strength under compression, tension and shearing. Proceedings of the Electronic Packaging Technology Conference, EPTC : 380-385. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469839||Abstract:||Studies on strain rate sensitivity of solder joints at high rates are relatively scarce. This investigation explores the possibility of establishing an experimental technique using a split Hopkinson bar to test single solder specimens. Computational simulation of tests on a cylindrical specimen the size of the solder ball is also performed to validate the assumption of one dimensional wave propagation as well as accuracy of stress-strain data derived. Tests on actual 0.24mm diameter solder balls show good repeatability of results, confirming the feasibility of applying the SHB technique. Average dynamic stress-strain curves for strain rates ranging from 102/s to 10 3/s were obtained and compared with average responses corresponding to quasi-static strain rates of 10-3 /s and 1/s for compression, tension and shear loading. Rate sensitivity of the solder ball response is observed. © 2007 IEEE.||Source Title:||Proceedings of the Electronic Packaging Technology Conference, EPTC||URI:||http://scholarbank.nus.edu.sg/handle/10635/85933||ISBN:||1424413249||DOI:||10.1109/EPTC.2007.4469839|
|Appears in Collections:||Staff Publications|
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