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Gupta Manoj

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Full Name
Gupta Manoj
Variants
Gupta, M.
Gupta M.
Manoj, G.
Gupta, M.Manoj
Gupta M
Gupta, Manoj
GUPTA, MANOJ
 
Main Affiliation
 
Faculty
 
Email
mpegm@nus.edu.sg
 

Publications

Refined By:
Author:  Nai, S.M.L.

Results 1-20 of 38 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
12009Development and characterization of magnesium composites using nano-size oxide-based reinforcementNai, M.H.; Nai, S.M.L.; Gupta, M. 
22005Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulatesNai, S.M.L.; Wei, J.; Gupta, M. 
37-Sep-2008Development of Al and Al/Cu (composite/alloy) formulations with enhanced properties through microwave power variations during hybrid sinteringKotecha, R.D.; Nai, S.M.L.; Gupta, M. 
412-May-2009Development of high strength Sn-Cu solder using copper particles at nanolength scaleAlam, M.E.; Nai, S.M.L.; Gupta, M. 
52009Development of lead-free nanocomposite solders using oxide based reinforcementBabaghorbani, P.; Nai, S.M.L.; Gupta, M. 
62009Development of lead-free Sn-3.5Ag/SnO 2 nanocomposite soldersBabaghorbani, P.; Nai, S.M.L.; Gupta, M. 
72006Development of lead-free solder composites containing nanosized hybrid (ZrO2 + 8 mol.% y2O3) particulatesNai, S.M.L.; Wei, J.; Gupta, M. 
86-Aug-2009DFT study on nano structures of Sn/CNT complex for potential Li-Ion battery applicationZheng, J.W.; Nai, S.M.L.; Ng, M.F.; Wu, P.; Wei, J.; Gupta, M. 
9Dec-2009Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substratesAlam, M.E.; Nai, S.M.L.; Gupta, M. 
10Apr-2008Effect of carbon nanotubes on the shear Strength and electrical resistivity of a lead-free solderNai, S.M.L.; Wei, J.; Gupta, M. 
112009Effect of nano size copper addition on the tensile properties of tinAlam, M.E.; Nai, S.M.L.; Gupta, M. 
122009Effect of nano-size oxide based reinforcement on the tensile properties of Sn-Ag-Cu solderNai, S.M.L.; Wei, J.; Gupta, M. 
132006Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solderNai, S.M.L.; Wei, J.; Gupta, M. 
142009Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloyZhong, X.L. ; Nai, S.M.L.; Gupta, M. 
152010Enhancement of mechanical properties by reinforcing magnesium with Ni-coated carbon nanotubesNai, M.H.; Goh, C.S.; Nai, S.M.L.; Wei, J.; Gupta, M. 
162009Enhancing mechanical response of a 96.5Sn-3.0Ag-0.5Cu solder using energy efficient microwave assisted sintering routeNai, S.M.L.; Kuma, J.V.M. ; Gupta, M. 
172004Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulatesNai, S.M.L.; Wong, C.K.; Wei, J.; Gupta, M. 
18Aug-2005Evelopment of novel lead-free solder composites using carbon nanotube reinforcementsNai, S.M.L.; Gupta, M. ; Wei, J.
1915-May-2006Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubesNai, S.M.L.; Wei, J.; Gupta, M. 
2010-May-2006Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder compositesNai, S.M.L.; Wei, J.; Gupta, M.