Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy

Abstract

Sn-0.7Cu lead-free solder alloy reinforced with sub-micron size alumina particulates in different volume percentage was synthesized using powder metallurgy technique incorporated with microwave sintering. Following synthesis, the extruded materials were characterized in terms of physical and mechanical properties. The density values of the composite solder materials were found to decrease with an increase in volume percentage of alumina particulates. The results of room temperature tensile test revealed that yield stress and ultimate tensile stress of the composite solder materials improved with the addition of alumina particulates. Particular emphasis is placed to interrelate the effect of volume fraction of sub-micron size alumina particulate added in the Sn-0.7Cu alloy with the physical and tensile properties of the resultant composite solder materials.